Use of Flow Simulation for Design and Process Optimisation for Flip Chip Underfill

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI:10.1109/POLYTR.2005.1596511

R. Miessner, T. Haeussermann

{"title":"Use of Flow Simulation for Design and Process Optimisation for Flip Chip Underfill","authors":"R. Miessner, T. Haeussermann","doi":"10.1109/POLYTR.2005.1596511","DOIUrl":null,"url":null,"abstract":"A study on impact of geometry and process parameters on underfill flow has been conducted. Relevant material properties (time and temperature dependent viscosity, contact angles to relevant surfaces, surface tension) have been measured and fit into numerical models as input for CFD modelling tool. First, a simple flow test vehicle (glass slide) has been modelled and compared with flow time measurements. It can be stated that the simulation is in very good agreement with experiments. This was the prerequisite for the following modelling of a flip chip. A variation of geometry parameters (e.g. stand-off, bump pitch) as well as process parameters (e.g. dispense pattern, needle velocity) have been modelled. Additionally, the impact of these parameters has been studied experimentally. Again, modelling results are in very good agreement with experimental results. Thus, modelling of underfill flow has been established as tool for optimisation of underfill parameters and prediction of process robustness.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2005.1596511","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

A study on impact of geometry and process parameters on underfill flow has been conducted. Relevant material properties (time and temperature dependent viscosity, contact angles to relevant surfaces, surface tension) have been measured and fit into numerical models as input for CFD modelling tool. First, a simple flow test vehicle (glass slide) has been modelled and compared with flow time measurements. It can be stated that the simulation is in very good agreement with experiments. This was the prerequisite for the following modelling of a flip chip. A variation of geometry parameters (e.g. stand-off, bump pitch) as well as process parameters (e.g. dispense pattern, needle velocity) have been modelled. Additionally, the impact of these parameters has been studied experimentally. Again, modelling results are in very good agreement with experimental results. Thus, modelling of underfill flow has been established as tool for optimisation of underfill parameters and prediction of process robustness.

查看原文本刊更多论文

流动模拟在倒装芯片底填设计和工艺优化中的应用

研究了几何形状和工艺参数对下填料流动的影响。相关的材料特性(与时间和温度相关的粘度、与相关表面的接触角、表面张力)已经被测量并拟合到数值模型中，作为CFD建模工具的输入。首先，建立了一个简单的流动测试车辆(玻璃载玻片)模型，并与流动时间测量结果进行了比较。结果表明，仿真结果与实验结果吻合较好。这是接下来倒装芯片建模的先决条件。几何参数的变化(例如，隔离，凹凸间距)以及工艺参数(例如，分配模式，针速度)已经建模。此外，还对这些参数的影响进行了实验研究。再一次，模拟结果与实验结果非常吻合。因此，建立了下填料流模型，作为优化下填料参数和预测过程鲁棒性的工具。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

自引率

0.00%

发文量