LCD玻璃上Au碰撞IC到ITO的接触电阻测量

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI:10.1109/POLYTR.2005.1596507

L. Beckers, E. Schiepers, M. Raes, M. Smeets, A. van der Lugt

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引用次数: 0

摘要

采用四线电阻测量方法，利用各向异性导电膜(ACF)对玻璃上芯片(COG)键合的接触电阻进行了评估，以避免对ITO轨道的串联电阻进行补偿。对四线测量法和菊花链测量法进行了比较。在菊花链设计中，ITO轨道除了接触区域外都是金属化的。结果表明，这些测量方法之间存在很大差异。为了理解这种差异，进行了仿真，显示了4线测量方法的系统误差。将测量和模拟从ITO扩展到覆盖ITO的金属轨道，对单个ACF颗粒使用相同的接触电阻，显示4线测量方法与菊花链测量方法完美匹配。模拟还得出了单个ACF颗粒接触电阻的可靠值。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Contact resistance measurement for Au bumped IC to ITO on glass for LCD's

A 4-wire resistance measurement method is used to evaluate the contact resistance of Chip On Glass (COG) bonding using Anisotropic Conductive Film (ACF) to prevent the need of compensation for series resistance of the ITO tracks. A comparison is made between the 4-wire measuring method and a Daisy chain measuring method. In the Daisy chain design the ITO tracks are metalized except for the contact area. The results show a very large difference between these measuring methods. To understand this difference, simulations are done, showing a systematic error in the 4-wire measuring method. Extending the measurements and simulations from ITO to metal tracks covered with ITO, using the same contact resistance for a single ACF particle show for the 4-wire measuring method as for the Daisy chain measuring method a perfect fit. The simulations also resulted in a reliable value for the contact resistance for a single ACF particle.

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Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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