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Active and Passive Electronic Components最新文献

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Total Ionizing Dose Effects of Si Vertical Diffused MOSFET with SiO2 and Si3N4/SiO2 Gate Dielectrics 具有SiO2和Si3N4/SiO2栅极电介质的Si垂直扩散MOSFET的总电离剂量效应
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-10-15 DOI: 10.1155/2017/9685685
Jiongjiong Mo, Xuran Zhao, Min Zhou
{"title":"Total Ionizing Dose Effects of Si Vertical Diffused MOSFET with SiO2 and Si3N4/SiO2 Gate Dielectrics","authors":"Jiongjiong Mo, Xuran Zhao, Min Zhou","doi":"10.1155/2017/9685685","DOIUrl":"https://doi.org/10.1155/2017/9685685","url":null,"abstract":"The total ionizing dose irradiation effects are investigated in Si vertical diffused MOSFETs (VDMOSs) with different gate dielectrics including single SiO2 layer and double Si3N4/SiO2 layer. Radiation-induced holes trapping is greater for single SiO2 layer than for double Si3N4/SiO2 layer. Dielectric oxidation temperature dependent TID effects are also studied. Holes trapping induced negative threshold voltage shift is smaller for SiO2 at lower oxidation temperature. Gate bias during irradiation leads to different shift for different gate dielectrics. Single SiO2 layer shows the worst negative at , while double Si3N4/SiO2 shows negative shift at , positive shift at , and negligible shift at .","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":"2017 1","pages":"1-7"},"PeriodicalIF":0.4,"publicationDate":"2017-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/9685685","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43829173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Power Device Thermal Fault Tolerant Control of High-Power Three-Level Explosion-Proof Inverter Based on Holographic Equivalent Dual-Mode Modulation 基于全息等效双模调制的大功率三电平防爆逆变器功率器件热容错控制
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-10-02 DOI: 10.1155/2017/6961832
Shi-Zhou Xu, Chun-jie Wang, Yu-feng Peng
{"title":"Power Device Thermal Fault Tolerant Control of High-Power Three-Level Explosion-Proof Inverter Based on Holographic Equivalent Dual-Mode Modulation","authors":"Shi-Zhou Xu, Chun-jie Wang, Yu-feng Peng","doi":"10.1155/2017/6961832","DOIUrl":"https://doi.org/10.1155/2017/6961832","url":null,"abstract":"It is necessary for three-level explosion-proof inverters to have high thermal stability and good output characteristics avoiding problems caused by power devices, such as IGBT, so it becomes a hot and difficult research point using only one control algorithm to guarantee both output characteristics and high thermal stability. Firstly, the simplified SVPWM (Space Vector Pulse Width Modulation) algorithm was illustrated based on the NPC (neutral-point-clamped) three-level inverter, and then the quasi-square wave control was brought in and made into a novel holographic equivalent dual-mode modulation algorithm together with the simplified SVPWM. The holographic equivalent model was established to analyze the relative advantages comparing with the two single algorithms. Finally, the dynamic output and steady power device losses were analyzed, based on which the power loss calculation and system simulation were conducted as well. The experiment proved that the high-power three-level explosion-proof inverter has good output characteristics and thermal stability.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-9"},"PeriodicalIF":0.4,"publicationDate":"2017-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/6961832","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44498043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of 0.8–2.7 GHz High Power Class-F Harmonic-Tuned Power Amplifier with Parasitic Compensation Circuit 带寄生补偿电路的0.8 ~ 2.7 GHz大功率f类谐波调谐功率放大器设计
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-06-14 DOI: 10.1155/2017/2543917
Zhiqun Cheng, Xuefei Xuan, Huajie Ke, Guohua Liu, Zhihua Dong, S. Gao
{"title":"Design of 0.8–2.7 GHz High Power Class-F Harmonic-Tuned Power Amplifier with Parasitic Compensation Circuit","authors":"Zhiqun Cheng, Xuefei Xuan, Huajie Ke, Guohua Liu, Zhihua Dong, S. Gao","doi":"10.1155/2017/2543917","DOIUrl":"https://doi.org/10.1155/2017/2543917","url":null,"abstract":"The design, implementation, and measurements of a high efficiency and high power wideband GaN HEMT power amplifier are presented. Package parasitic effect is reduced significantly by a novel compensation circuit design to improve the accuracy of impedance matching. An improved structure is proposed based on the traditional Class-F structure with all even harmonics and the third harmonic effectively controlled, respectively. Also the stepped-impedance matching method is applied to the third harmonic control network, which has a positive effect on the expansion bandwidth. CGH40025F power transistor is utilized to build the power amplifier working at 0.8 to 2.7 GHz, with the measured saturated output power 20–50 W, drain efficiency 52%–76%, and gain level above 10 dB. The second and the third harmonic suppression levels are maintained at −16 to −36 dBc and −16 to −33 dBc, respectively. The simulation and the measurement results of the proposed power amplifier show good consistency.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":"2017 1","pages":""},"PeriodicalIF":0.4,"publicationDate":"2017-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/2543917","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44338648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Less-Conventional Low-Consumption Galvanic Separated MOSFET-IGBT Gate Drive Supply 不太常见的低功耗电流分离MOSFET-IGBT栅极驱动电源
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-05-24 DOI: 10.1155/2017/4181549
Jean Marie V. Bikorimana, A. V. Bossche
{"title":"Less-Conventional Low-Consumption Galvanic Separated MOSFET-IGBT Gate Drive Supply","authors":"Jean Marie V. Bikorimana, A. V. Bossche","doi":"10.1155/2017/4181549","DOIUrl":"https://doi.org/10.1155/2017/4181549","url":null,"abstract":"A simple half-bridge, galvanic separated power supply which can be short circuit proof is proposed for gate driver local supplies. The supply is made while hacking a common mode type filter as a transformer, as the transformer shows a good insulation, it has a very low parasitic capacitance between primary and secondary coils, and it is cost-effective. Very low standby losses were observed during lab experiments. This makes it compatible with energy efficient drives and solar inverters.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-8"},"PeriodicalIF":0.4,"publicationDate":"2017-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/4181549","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47431146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparative Simulation Analysis of Process Parameter Variations in 20 nm Triangular FinFET 20nm三角FinFET工艺参数变化的比较仿真分析
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-03-21 DOI: 10.1155/2017/5947819
Satyam Shukla, S. S. Gill, Navneet Kaur, H. S. Jatana, Varun Nehru
{"title":"Comparative Simulation Analysis of Process Parameter Variations in 20 nm Triangular FinFET","authors":"Satyam Shukla, S. S. Gill, Navneet Kaur, H. S. Jatana, Varun Nehru","doi":"10.1155/2017/5947819","DOIUrl":"https://doi.org/10.1155/2017/5947819","url":null,"abstract":"Technology scaling below 22 nm has brought several detrimental effects such as increased short channel effects (SCEs) and leakage currents. In deep submicron technology further scaling in gate length and oxide thickness can be achieved by changing the device structure of MOSFET. For 10–30 nm channel length multigate MOSFETs have been considered as most promising devices and FinFETs are the leading multigate MOSFET devices. Process parameters can be varied to obtain the desired performance of the FinFET device. In this paper, evaluation of on-off current ratio ( ), subthreshold swing (SS) and Drain Induced Barrier Lowering (DIBL) for different process parameters, that is, doping concentration (1015/cm3 to 1018/cm3), oxide thickness (0.5 nm and 1 nm), and fin height (10 nm to 40 nm), has been presented for 20 nm triangular FinFET device. Density gradient model used in design simulation incorporates the considerable quantum effects and provides more practical environment for device simulation. Simulation result shows that fin shape has great impact on FinFET performance and triangular fin shape leads to reduction in leakage current and SCEs. Comparative analysis of simulation results has been investigated to observe the impact of process parameters on the performance of designed FinFET.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":"364 4","pages":"1-8"},"PeriodicalIF":0.4,"publicationDate":"2017-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/5947819","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41287981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Microwave Impedance Spectroscopy and Temperature Effects on the Electrical Properties of Au/BN/C Interfaces 微波阻抗谱及温度对Au/BN/C界面电性能的影响
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-02-26 DOI: 10.1155/2017/4791347
H. Khanfar, A. F. Qasrawi, Yasmeen Kh. Ghannam
{"title":"Microwave Impedance Spectroscopy and Temperature Effects on the Electrical Properties of Au/BN/C Interfaces","authors":"H. Khanfar, A. F. Qasrawi, Yasmeen Kh. Ghannam","doi":"10.1155/2017/4791347","DOIUrl":"https://doi.org/10.1155/2017/4791347","url":null,"abstract":"In the current study, an Au/BN/C microwave back-to-back Schottky device is designed and characterized. The device morphology and roughness were evaluated by means of scanning electron and atomic force microscopy. As verified by the Richardson–Schottky current conduction transport mechanism which is well fitted to the experimental data, the temperature dependence of the current-voltage characteristics of the devices is dominated by the electric field assisted thermionic emission of charge carriers over a barrier height of ~0.87 eV and depletion region width of ~1.1 μm. Both the depletion width and barrier height followed an increasing trend with increasing temperature. On the other hand, the alternating current conductivity analysis which was carried out in the frequency range of 100–1400 MHz revealed the domination of the phonon assisted quantum mechanical tunneling (hopping) of charge carriers through correlated barriers (CBH). In addition, the impedance and power spectral studies carried out in the gigahertz-frequency domain revealed a resonance-antiresonance feature at frequency of  ~1.6 GHz. The microwave power spectra of this device revealed an ideal band stop filter of notch frequency of  ~1.6 GHz. The ac signal analysis of this device displays promising characteristics for using this device as wave traps.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-8"},"PeriodicalIF":0.4,"publicationDate":"2017-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/4791347","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45137687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of a SIW Bandpass Filter Using Defected Ground Structure with CSRRs 基于缺陷接地结构的SIW带通滤波器设计
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-01-29 DOI: 10.1155/2017/1606341
Weiping Li, Z. Tang, Xin Cao
{"title":"Design of a SIW Bandpass Filter Using Defected Ground Structure with CSRRs","authors":"Weiping Li, Z. Tang, Xin Cao","doi":"10.1155/2017/1606341","DOIUrl":"https://doi.org/10.1155/2017/1606341","url":null,"abstract":"In this paper, a substrate integrated waveguide (SIW) bandpass filter using defected ground structure (DGS) with complementary split ring resonators (CSRRs) is proposed. By using the unique resonant properties of CSRRs and DGSs, two passbands with a transmission zero in the middle have been achieved. The resonant modes of the two passbands are different and the bandwidth of the second passband is much wider than that of the first one. In order to increase out-of-band rejection, a pair of dumbbell DGSs has been added on each side of the CSRRs. The structure is analyzed using equivalent circuit models and simulated based on EM simulation software. For validation, the proposed filter is fabricated and measured. The measurement results are in good agreement with the simulated ones.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-6"},"PeriodicalIF":0.4,"publicationDate":"2017-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/1606341","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44874892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Design Impedance Mismatch Physical Unclonable Functions for IoT Security 设计阻抗失配物联网安全的物理不可克隆功能
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-01-24 DOI: 10.1155/2017/4070589
Xiaomin Zheng, Yuejun Zhang, Jiaweng Zhang, Huang Wenqi
{"title":"Design Impedance Mismatch Physical Unclonable Functions for IoT Security","authors":"Xiaomin Zheng, Yuejun Zhang, Jiaweng Zhang, Huang Wenqi","doi":"10.1155/2017/4070589","DOIUrl":"https://doi.org/10.1155/2017/4070589","url":null,"abstract":"We propose a new design, Physical Unclonable Function (PUF) scheme, for the Internet of Things (IoT), which has been suffering from multiple-level security threats. As more and more objects interconnect on IoT networks, the identity of each thing is very important. To authenticate each object, we design an impedance mismatch PUF, which exploits random physical factors of the transmission line to generate a security unique private key. The characteristic impedance of the transmission line and signal transmission theory of the printed circuit board (PCB) are also analyzed in detail. To improve the reliability, current feedback amplifier (CFA) method is applied on the PUF. Finally, the proposed scheme is implemented and tested. The measure results show that impedance mismatch PUF provides better unpredictability and randomness.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-8"},"PeriodicalIF":0.4,"publicationDate":"2017-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/4070589","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42742532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Simultaneous Suppression of IMD3 and IMD5 in Space TWT by IMD3 and 2HD Signal Injection IMD3和2HD信号注入对空间行波管中IMD3和IMD5的同时抑制
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-01-10 DOI: 10.1155/2017/4721048
Dongming Zhao, Huijuan Liu, Ke-wen Xia, Shi Li, Xiaoxu Shi
{"title":"Simultaneous Suppression of IMD3 and IMD5 in Space TWT by IMD3 and 2HD Signal Injection","authors":"Dongming Zhao, Huijuan Liu, Ke-wen Xia, Shi Li, Xiaoxu Shi","doi":"10.1155/2017/4721048","DOIUrl":"https://doi.org/10.1155/2017/4721048","url":null,"abstract":"This paper presents a signal injection technology showing significant reductions in both 3rd-order and 5th-order intermodulation distortions (IMD3 and IMD5) in space traveling wave tube (STWT). By applying the IMD3 to the IMD5 ratio (TFR) as measures of location, the simultaneous suppressions of IMD3 and IMD5 in TWT are achieved by second harmonic distortion (2HD) and IMD3 injection. According to the research on theoretical analysis and computer simulation, the optimum amplitude and phase parameters of the injected signal for maximum simultaneous suppressions are obtained. Then an experiment system is established based on vector network analyzer, optimum TFR are 2.1 dB and 12.5 dB, respectively, by second harmonic and IM3 injection, and the output powers of IMD3 and IMD5 were decreased. TFR with IMD3 injection is smaller than that with second harmonic injection in STWT, and the experiment system is more straightforward and easy to operate. Thus, the IMD3 injection performs better than that of second harmonic injection to suppress IMD5s for the narrow-band STWT.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":"1-9"},"PeriodicalIF":0.4,"publicationDate":"2017-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/4721048","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43619726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits 高速CMOS电路多电源配电网同时开关噪声的研究与分析
IF 0.4
Active and Passive Electronic Components Pub Date : 2017-01-01 DOI: 10.1155/2017/9703029
Khaoula Ait Belaid, H. Belahrach, H. Ayad
{"title":"Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits","authors":"Khaoula Ait Belaid, H. Belahrach, H. Ayad","doi":"10.1155/2017/9703029","DOIUrl":"https://doi.org/10.1155/2017/9703029","url":null,"abstract":"The paper studies a simultaneous switching noise (SSN) in a power distribution network (PDN) with dual supply voltages and two cores. This is achieved by reducing the admittance matrix of the PDN then calculating frequency domain impedance with rational function approximation using vector fitting. This paper presents a method of computing the simultaneous switching noise through a switching current, whose properties and details are described. Thus, the results are discussed and performed using MATLAB and PSpice tools. It demonstrated that the presence of many cores in the same PCB influences the SSN due to electromagnetic coupling.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":"2017 1","pages":"1-10"},"PeriodicalIF":0.4,"publicationDate":"2017-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2017/9703029","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"64725814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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