2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)最新文献_第4页

Reduce simultaneous switching jitter in number, spatial, time, and frequency dimensions 减少同时开关抖动在数量，空间，时间和频率维度

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490802

Hui Liu, Hong Shi, J. Xie

引用次数: 1

Process characterization vehicles for 3D Integration 用于3D集成的工艺表征工具

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490841

D. V. Campbell

引用次数: 5

Assembly of a polymer lab-on-chip device for impedimetric measurements of D-dimers in whole blood 组装用于全血中d -二聚体阻抗测量的聚合物实验室芯片装置

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490824

A. Ohlander, Christof Strohhöfer, Karlheinz Bock, S. Scott, Zulfiqur Ali, P. Musil, J. Kyselovič

引用次数: 0

High rejection low-pass-filter design using integrated passive device technology for Chip-Scale Module Package 采用集成无源器件技术的芯片级模块封装高抑制低通滤波器设计

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490664

Yongtaek Lee, Kai Liu, R. Frye, Hyuntai Kim, Gwang Kim, B. Ahn

引用次数: 4

Micromechanics and damage processes in interconnect structures 互连结构的微观力学和损伤过程

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490653

A. Hsing, A. Kearney, L. Li, J. Xue, M. Brillhart, R. Dauskardt

引用次数: 0

A study of highly crosslinked Epoxy Molding Compound and its interface with copper substrate by molecular dynamic simulations 用分子动力学模拟方法研究高交联环氧树脂模塑复合材料及其与铜基体的界面

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490895

Shaorui Yang, F. Gao, J. Qu

{"title":"A study of highly crosslinked Epoxy Molding Compound and its interface with copper substrate by molecular dynamic simulations","authors":"Shaorui Yang, F. Gao, J. Qu","doi":"10.1109/ECTC.2010.5490895","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490895","url":null,"abstract":"A novel Epoxy Molding Compound (EMC) with a crosslinked network structure was formed by curing tri-/tetra-functionalized EPN1180 with Bisphenol-A. A full atomistic model reflecting the network nature of the material was constructed by applying an iterative crosslinking algorithm to an amorphous cell with 3D periodic boundary condition containing the stoichiometric mixture of constitutive monomers. The geometry of the model was then optimized using the COMPASS force-field in Materials Studio [1]. The variation of system density and volume against temperature was simulated using a cooling down profile, which was employed to derive the glass transition temperature and coefficient of thermal expansion of the system. Furthermore, the Young's modulus and Poisson's ratio were calculated by uni-axial tensile molecular statics simulations. The material properties computed by molecular dynamics/mechanics simulations were in good agreement with experiment measurements. An epoxy resin/copper interface model was constructed and the interfacial adhesion energy was calculated as the energy difference between the total energy of the entire system and the sum of the energies of individual materials. The traction-displacement law of the interface was derived when the system was subjected to a molecular statics uniaxial tension. The work of separation and the peak traction, considered as the two key parameters required by cohesive zone finite element simulation, were extracted from the traction-displacement law.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124341746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Energy harvesting using RF MEMS 利用射频MEMS进行能量收集

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490638

Yunhan Huang, R. Doraiswami, M. Osterman, M. Pecht

{"title":"Energy harvesting using RF MEMS","authors":"Yunhan Huang, R. Doraiswami, M. Osterman, M. Pecht","doi":"10.1109/ECTC.2010.5490638","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490638","url":null,"abstract":"This paper presents a novel technology which provides a promising solution for designing self-powered microsystems. Micro-Electro Mechanical System (MEMS) energy harvesting is an emerging alternative for scavenging energy from natural sources. It has extensive potential in wireless sensor applications to provide a natural energy source that is essentially inexhaustible. It is an increasingly attractive alternative to costly batteries. This essentially free energy source is available maintenance-free throughout the lifetime of the application. Many systems, such as wireless sensor networks, portable electronics and cell phones, can use this technology as a power source. Although some types of MEMS, such as electro-magnetic MEMS, electrostatic MEMS, and piezoelectric MEMS, are used to provide energy in various applications, they have several technical barriers that limit their applications, including low efficiency, issues of scaling, and high cost. Our novel MEMS solar energy harvesting technology is scalable and also easily integrated in microsystems. The RF MEMS design not only has to provide functional efficiency, but also must work within the limits of maximum charge and discharge conversion efficiency. The energy harvesting technologies currently available which utilizes RF MEMS to convert solar energy into charge, can achieve better benefits than photovoltaic cells. In this paper we provide design, fabrication, testing and evaluation of RF MEMS and its working limits in charging and discharging.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114332923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Thermal stability of the dielectric properties of the low-loss, organic material RT/duroid 6002 from 30 GHz to 70 GHz 低损耗有机材料RT/duroid 6002介电性能在30 ~ 70 GHz范围内的热稳定性

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490714

C. D. Morcillo, S. Bhattacharya, A. Horn, J. Papapolymerou

引用次数: 6

Modeling and measurements of lead titanate acoustic transducers for input impedance matching development 用于输入阻抗匹配开发的钛酸铅声学换能器的建模和测量

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490693

K. Son, Chin C. Lee

{"title":"Modeling and measurements of lead titanate acoustic transducers for input impedance matching development","authors":"K. Son, Chin C. Lee","doi":"10.1109/ECTC.2010.5490693","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490693","url":null,"abstract":"Lead titanate (PbTiO3) is a popular piezoelectric material for acoustic transducers because of its high electromechanical coupling coefficient. To drive a transducer effectively, its input impedance must match well to the generator output impedance, usually 50Ω. To develop impedance matching technique, an equivalent circuit model is established. PT piezoelectric plates are bonded on bismuth, Lucite and LCP, respectively to form transducers. The input impedance of the transducers is calculated and also measure versus frequency. It is discovered that there are two off-resonant frequencies at which the reactance part of the input impedance is zero, referred to as the zero-crossing frequency. This is possible because of an inherent electrical property of the transducer, the existence of the plate capacitance. The higher zero-crossing frequency is close to the resonant frequency. The input resistance is usually very high. At the lower zero-crossing frequency, the input resistance is close to 50Ω for practical plate sizes. Thus, good impedance matching can be achieved by operating at this frequency. The matching can be fine tuned by adjusting transducer electrode size and controlling the bonding layer thickness. Nearly perfect matching is demonstrated without using any external component. The simulated and measurement response curves versus frequency also show the transducer bandwidth.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117073257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A new plasma source for next generation MEMS deep Si etching: Minimal tilt, improved profile uniformity and higher etch rates 用于下一代MEMS深硅刻蚀的新型等离子体源:最小的倾斜，改善的轮廓均匀性和更高的刻蚀速率

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490831

R. Barnett, D. Thomas, Yiping Song, D. Tossell, T. Barrass, O. Ansell

引用次数: 26