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2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Education 4.0: Innovation Learning Lab for AI-Analysis and Concept Proposal 教育4.0:人工智能分析和概念提案创新学习实验室
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663426
M. Ciolacu, Bernhard Haderer, A. Berl, P. Svasta
{"title":"Education 4.0: Innovation Learning Lab for AI-Analysis and Concept Proposal","authors":"M. Ciolacu, Bernhard Haderer, A. Berl, P. Svasta","doi":"10.1109/SIITME53254.2021.9663426","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663426","url":null,"abstract":"The Industry 4.0 revolution marks a turning point in many areas – the digitization of the industry, and exposes the shortcomings in Higher Education, from inadequate infrastructures to digital literacy, digital teaching and learning scenarios. This paper describes and analyses the hardware and the software concept for an Education 4.0 Innovation Learning Lab for Artificial Intelligence (E4ILLAI). This can be used in higher education, but also for further research projects. Graphics processing unit (GPU) and AI developer kits are analysed, as an important part of the laboratory, but also criteria such as modularity, easy to use, prototyping, low cost, and flexibility plays an important role. Our contribution is developing competences in dealing with AI systems such as robots for autonomous systems (e.g. Waveshare JetBots) as well as with humanoid robots (NAO6) for support in the health care institutions.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"363 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124565651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
In-circuit ESR Measurement Method for Electrolytic Capacitors 电解电容器的在线ESR测量方法
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663652
Magdalena Marinca, Elisei Ilieş, Corneliu Bărbulescu, A. Gontean
{"title":"In-circuit ESR Measurement Method for Electrolytic Capacitors","authors":"Magdalena Marinca, Elisei Ilieş, Corneliu Bărbulescu, A. Gontean","doi":"10.1109/SIITME53254.2021.9663652","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663652","url":null,"abstract":"This paper presents an Equivalent Series Resistance (ESR) measurement method that involves the application of short voltage pulses to an electrolytic capacitor. In the proposed method, the value of the ESR is given by linear interpolating the charging curve of the capacitor taking several appropriate points. In order to validate our measurement method, we compared the values obtained from the practical experiments with the results provided by a BK Precision 891 Bench LCR Meter. After comparison, we found that the experimental results are very close to the values provided by the LCR Meter, the maximum relative error being less than 12%.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"128 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124988125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Retrofitting Video Surveillance Systems using Deep Learning Technologies 利用深度学习技术改造视频监控系统
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663613
Mihai Traian Andreescu, R. Mîrsu, C. Căleanu
{"title":"Retrofitting Video Surveillance Systems using Deep Learning Technologies","authors":"Mihai Traian Andreescu, R. Mîrsu, C. Căleanu","doi":"10.1109/SIITME53254.2021.9663613","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663613","url":null,"abstract":"Steps toward the development of an embedded system that is able to enhance the capabilities of a video surveillance system are described within the proposed paper. The hardware support for our solution is based on the newly introduced Google Coral development board having, as a prominent feature, the on-board Edge Tensor Processing Unit, capable of execute state-of-the-art mobile vision models such as MobileNet v2 at 100+ FPS, in a power efficient manner. The Google Coral is proven to outperform competing Machine Learning hardware accelerators currently available on the market and so represents the best accuracy/power efficiency choice. The software part includes some deep learning-based modules for video analytics such as detection, classification and tracking objects, including cars and people, using MobileNet + SSD architecture. Also, the experimental setup is described: compiling OpenCV for Google Coral, connecting to the video stream of the surveillance cameras. The system supports video equipment by any manufacturer by interfacing to it using Real Time Streaming Protocol/Open Network Video Interface Forum connections.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125068377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment 基于传感器的大学实验室环境下电子制造物联网监控
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663576
A. Géczy, Lajos Kuglics, István Megyeri, Róbert Gelbmann, G. Harsányi
{"title":"Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment","authors":"A. Géczy, Lajos Kuglics, István Megyeri, Róbert Gelbmann, G. Harsányi","doi":"10.1109/SIITME53254.2021.9663576","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663576","url":null,"abstract":"We present a sensor-based IoT monitoring of an electronics manufacturing laboratory in a university environment. The project focuses on the possibilities of retrofitting the current electronics manufacturing equipment (e.g., surface mount technology apparatus) with sensors to gather extensive in-situ information about the critical parameters of the machines and their ambient surroundings. The project is based on two different sensor nodes functioning as fixed and mobile measurement devices around the given points of the laboratory located at our university. The demonstration presents a cost-effective solution of retrofitting machines with IoT-based sensor nodes, enabling new data acquisition functionalities. Also, the demonstration shows an example of a system from where the students can learn about IoT and Industry 4.0 requirements in their educational environment and from remote access. The project also highlights the importance of operational safety and health (OSH) in such workplaces. The paper presents the block diagrams and the functionalities of the sensor nodes. Also, it presents the frontend and backend setup. The user interface layers are also presented, one, which is available through web access, and the other is a proprietary app for clear visualization of the recorded data. The two approaches share the same SQL database, which is stored on the server.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129545274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Improved Affine Projection Algorithm for the Identification of Multilinear Forms 多线性形式识别的改进仿射投影算法
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663648
Laura-Maria Dogariu, C. Paleologu, J. Benesty, S. Ciochină
{"title":"Improved Affine Projection Algorithm for the Identification of Multilinear Forms","authors":"Laura-Maria Dogariu, C. Paleologu, J. Benesty, S. Ciochină","doi":"10.1109/SIITME53254.2021.9663648","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663648","url":null,"abstract":"In this paper, we address the multilinear system identification problem in the framework of multiple-input single-output (MISO) systems. The large parameter space of such systems can be reshaped into a tensorial form. In this context, the affine projection algorithm (APA) is an appealing solution, especially with correlated input signals. The recently developed tensor-based APA (APA-T) combines the solutions provided by the individual (shorter) filters, thus reformulating a high-dimension system identification problem based on low-dimension problems. Following the development of the APA-T, we propose in this paper an improved version of this algorithm, where different projection orders are used for the individual filters. This approach leads to a better compromise between performance and complexity.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128906916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
POL DC-DC Converter Output Capacitor Bank’s Reliability Comparison using Prediction Standard MIL-HDBK-217F and SN 29500 基于预测标准MIL-HDBK-217F和SN 29500的POL DC-DC变换器输出电容组可靠性比较
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663431
Dan Butnicu
{"title":"POL DC-DC Converter Output Capacitor Bank’s Reliability Comparison using Prediction Standard MIL-HDBK-217F and SN 29500","authors":"Dan Butnicu","doi":"10.1109/SIITME53254.2021.9663431","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663431","url":null,"abstract":"A higher level of reliability became a compulsory demand in modern DC-DC converters [4]. Since the latest version MIL-HDBK-217F Notice 2 released in 1995 [1], newer failure rate prediction standards had appeared on the electronic systems reliability market. These are introduced to compensate for the lack of the newest component technology in the above-mentioned standard. When it comes to reliability many studies have shown that the output capacitor bank is demonstrated to be the most critical component [3]. In this work, the failure rate of an output capacitor bank used within a high current low voltage buck converter is calculated both by the latest prediction standard SN 29500 and by with the previous standard MIL-HDBK, providing a comparison between the two which is a helpful tool for the output capacitor selection in the early stage design. The components’ environmental conditions were defined by a standard POL buck converter used for both calculation methodologies. Results are compared by taking account of the influence of the component’s temperature and application of specific parameters such as temperature cycles.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114991969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Efficient Unaligned Memory Access of Tightly Packed Weights for Deep Neural Network Inference on Edge Devices 边缘设备上深度神经网络推理中紧包权的高效非对齐内存访问
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663723
Ciprian Seiculescu
{"title":"Efficient Unaligned Memory Access of Tightly Packed Weights for Deep Neural Network Inference on Edge Devices","authors":"Ciprian Seiculescu","doi":"10.1109/SIITME53254.2021.9663723","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663723","url":null,"abstract":"The increase in computational power enabled complex problems to be solved by employing new techniques from the field of Artificial Intelligence (AI) based on Deep Neural Networks (DNN) and Deep Learning (DL). A recent trend is to apply these techniques that have proven to generate excellent results to Edge computing. However, Edge computing is based on simple low power devices, which are severely restricted in terms of computational power and especially by the available memory size. Being able to pack the Neural Network parameters in the available memory efficiently is a must. Normally, memory systems expect transactions to be aligned to the bus size for maximum performance. This can result in inefficient memory utilization, as the groups of parameters required to be read in parallel need to be stored aligned in memory. In this paper, I present a memory controller to provide unaligned memory transfers at full bus width. When using this controller, the memory efficiency can be increased by 25%, while preserving the memory access time.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125936474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study on Counter-flow Air to Air Heat Exchange for Air Handling Unit of Smart Buildings 智能建筑空气处理机组反流式空气换热研究
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663600
V. Nicolau, M. Andrei, G. Petrea
{"title":"Study on Counter-flow Air to Air Heat Exchange for Air Handling Unit of Smart Buildings","authors":"V. Nicolau, M. Andrei, G. Petrea","doi":"10.1109/SIITME53254.2021.9663600","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663600","url":null,"abstract":"Minimizing the energy consumption is a major factor for all smart buildings. As a result, heat exchangers are used for energy recovery. The simplest heat exchanger is tube-in-tube type, in which the counter-flow type is the most efficient. In this paper, counter-flow air to air heat exchanger is studied, using a lab scale model. Four temperature-humidity sensors are used to measure the input and output parameters for every end of each tube. The performance of heat exchanger is analyzed by means of experimental results. Different values of inlet temperature and humidity of hot air flow are applied, and spatial and temporal variable distributions are analyzed. The efficiency of heat exchanger can be observed even for small steps of inlet values.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127595400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Increasing Thermal Simulation Efficiency with 6SigmaET 利用6SigmaET提高热模拟效率
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663718
A. Fodor, A. Taut, G. Chindris
{"title":"Increasing Thermal Simulation Efficiency with 6SigmaET","authors":"A. Fodor, A. Taut, G. Chindris","doi":"10.1109/SIITME53254.2021.9663718","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663718","url":null,"abstract":"It is of utmost importance to have reliable electronics in this day and age, and as release times for electronics have shortened, ensuring electronics reliability has become challenging. This study presents a method of increasing the reliability of an electronic product by including well-defined thermal simulations in the design stage. Thus, 6SigmaET software tool was analyzed for in reference to modelling and simulation times, and effort needed to define a thermal simulation setup. The paper also demonstrates the importance of including thermal simulations early in the development stages of a product.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132175095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis and implementation of a band tracking system 一种波段跟踪系统的分析与实现
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663581
I. Baciu, L. Viman
{"title":"Analysis and implementation of a band tracking system","authors":"I. Baciu, L. Viman","doi":"10.1109/SIITME53254.2021.9663581","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663581","url":null,"abstract":"The topic of this article is a study on a direction tracking circuit. Out of the desire to eliminate human error or at least to minimize it, there was a desire to automate, as much as possible, the steering control and braking systems of cars. More and more cities want to use cars without a driver, and this application can be applied on such system. At first it was about using three infrared sensors, which could follow a certain path. The problem that occurs and can be observed in this article is that the tracking depends a lot on how that direction or line applied on the road reflect the infrared rays. However, for comparison it was used another type of sensor. The second type of sensor is TCS230, a color detection sensor.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130897060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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