2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献_第7页

Curriculum and Training Development in the METIS project METIS项目的课程和培训发展

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/siitme53254.2021.9663582

B. Medgyes, B. Illés, O. Krammer, S. Tzanova, S. Gavra

{"title":"Curriculum and Training Development in the METIS project","authors":"B. Medgyes, B. Illés, O. Krammer, S. Tzanova, S. Gavra","doi":"10.1109/siitme53254.2021.9663582","DOIUrl":"https://doi.org/10.1109/siitme53254.2021.9663582","url":null,"abstract":"To improve its competitiveness, the EU microelectronics area needs to overcome critical skills deficits. In this context, METIS (MicroElectronics Training, Industry and Skills) gives an individual European partnership establishing a sustainable structure to: analyze main global biases effecting on the area and offer strategic insights and foresights, predict rising skills demands, identify job rules/jobs of the future, determine important occupational profiles and observe progress in the domain of human capital for microelectronics, develop a Sector Skills Strategy to support the global leadership of the EU microelectronics industry, establishing operational linkages between skills and the future of the area, federate European synergies towards the needs of data-driven technologies such as artificial intelligence (AI) enabled by advanced microelectronics and its skills demands, establish an EU Microelectronics Observatory & Skills Council, plan and produce a modular and blended curriculum, integrating work-oriented learning that uses open education resources (OER), pave the way for the pan-European recognition of innovative Vocational Education and Training (VET), use innovative tools such as industry mentoring to facilitate inter-generational transfer of knowledge in the area, embed social (diversity & inclusion) and environmental sustainability (circular economy) subjects and EU policy aims in the development of workforce.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126807775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Investigation on Meandered Split Ring Resonator for Metamaterial Microwave Absorber Design 弯曲裂环谐振腔在超材料微波吸收器设计中的研究

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663630

I. Mocanu

引用次数: 0

Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing 图像数据聚类增强基于机器学习的THT制造质量控制

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663663

N. Thielen, Zonghan Jiang, K. Schmidt, Reinhardt Seidel, C. Voigt, A. Reinhardt, Joerg Franke

{"title":"Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing","authors":"N. Thielen, Zonghan Jiang, K. Schmidt, Reinhardt Seidel, C. Voigt, A. Reinhardt, Joerg Franke","doi":"10.1109/SIITME53254.2021.9663663","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663663","url":null,"abstract":"In this work, machine learning (ML) models are presented to identify false calls during quality control with automated optical inspection (AOI) in through hole technology (THT) manufacturing. While ML-based approaches with both, image data and numerical data, have already been investigated extensively in SMT manufacturing due to the higher market share, research for THT manufacturing does not have the same extend [1]. The presented models classify images into false calls and true defects, which were identified by the AOI as defects beforehand. Since the AOI uses different test routines to control pin, meniscus and foil of the different components and the board’s surface, multiple models for groups of images are developed to achieve better performance than a single one. To assign the images to the corresponding models, clustering of image data is done in two steps. First, the dataset is divided into subcategories based on the supplementary and descriptive data on the test routine. Second, the unsupervised machine learning algorithm k-means is used on images in each subgroup for further assignment to a dataset. A cumulative examination of the results of different convolutional neural networks (CNN) on the individual clusters leads to a relative improvement in false call detection of 6.8% while error slip can be reduced from 0.6% to 0% in an independent test data set, which is not used for model training.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125504027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Inquiry-Based Learning Used for Implementation of BCD Adders in the Course "Digital Electronics" 探究式学习在《数字电子学》课程中BCD加法器的实现

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663683

A. Borodzhieva, Ivanka D. Tsvetkova, S. Zaharieva, Dimitar Dimitrov, V. Mutkov

引用次数: 1

Application of Software for the Purpose of Enhancing Online Education 软件在网络教育中的应用

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663699

Ivanka D. Tsvetkova, A. Borodzhieva

引用次数: 0

CBIR for urban building using A-KAZE features 城市建筑CBIR利用A-KAZE的特点

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663587

Ciprian Orhei, Lucian Radu, M. Mocofan, Silviu Vert, R. Vasiu

引用次数: 3

Electronic Module for Control of Energy Source 用于能源控制的电子模块

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/siitme53254.2021.9663599

I. Stoev, S. Zaharieva, A. Borodzhieva

引用次数: 1

Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging 气候老化下导电胶接头电阻的数学建模

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663585

P. Mach, Robert Lacina

引用次数: 0

On Flight Real Time Image Processing by Drone Equipped with Raspberry Pi4 搭载树莓Pi4无人机的飞行实时图像处理

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663650

L. Szolga

引用次数: 4

Vibration Testing of a Solderless Electronic Module Manufactured by Additive Technique 用增材制造的无焊电子模块的振动测试

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663595

G. Vărzaru, Razvan Ungurelu, M. Branzei, B. Mihailescu, C. Ionescu, P. Svasta

{"title":"Vibration Testing of a Solderless Electronic Module Manufactured by Additive Technique","authors":"G. Vărzaru, Razvan Ungurelu, M. Branzei, B. Mihailescu, C. Ionescu, P. Svasta","doi":"10.1109/SIITME53254.2021.9663595","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663595","url":null,"abstract":"A new way of additively manufacturing electronic modules without the use of solder alloy was proposed. The result is a solid body consisting of superimposed layers of resin embedding electronic components interconnected by an electrically conductive material. Its stated purpose is to increase the reliability of electronics, but due to the novelty of the process, few papers are known to approach the subject. The paper is the first experimental study of the behavior of such a structure subject to mechanical stress. As known, the most common mechanical stress for electronics is vibration, but its parameters are different depending on the industry (aerospace, automotive, military, etc.). Regarding the vibration test, there are several types according to the purpose: performance, endurance, shipping. Our experiments were based on a well-known standard, MIL-STD-202G. The test module is a flat rectangular board made of two layers of epoxy resin embedding electronic components interconnected in a daisy-chain circuit. Tests and measurements (optical inspection, electrical continuity) were made before, during, and after vibrations. The lack of visible damage and undetectable interruption of the electrical circuitry is proof of the robustness of such structure when submitted to the recommended procedure from the Method 201A of the specified standard.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123510548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0