Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging

Abstract

The use of electrically conductive adhesives in electronics is still growing. As the number of applications of these materials grows, so does the spectrum of requirements for their properties. The most commonly used types of these adhesives are epoxy resin adhesives filled with silver flakes. One of the main disadvantages of these materials against lead-free solders is their low resistance to climatic stress. Therefore, for some applications, it must be tested for climate aging. Tests are most often performed at elevated temperature and elevated relative humidity. The article is focused on the calculation of mathematical models for the calculation of the resistance of adhesive joints from adhesives of four manufacturers made on pads with Cu and Ag surface finish. Aging is performed in a combined climate of elevated humidity / elevated temperature. Factor experiment technique was used to calculate the models. The created models showed good agreement with the measured data.