Vibration Testing of a Solderless Electronic Module Manufactured by Additive Technique

Abstract

A new way of additively manufacturing electronic modules without the use of solder alloy was proposed. The result is a solid body consisting of superimposed layers of resin embedding electronic components interconnected by an electrically conductive material. Its stated purpose is to increase the reliability of electronics, but due to the novelty of the process, few papers are known to approach the subject. The paper is the first experimental study of the behavior of such a structure subject to mechanical stress. As known, the most common mechanical stress for electronics is vibration, but its parameters are different depending on the industry (aerospace, automotive, military, etc.). Regarding the vibration test, there are several types according to the purpose: performance, endurance, shipping. Our experiments were based on a well-known standard, MIL-STD-202G. The test module is a flat rectangular board made of two layers of epoxy resin embedding electronic components interconnected in a daisy-chain circuit. Tests and measurements (optical inspection, electrical continuity) were made before, during, and after vibrations. The lack of visible damage and undetectable interruption of the electrical circuitry is proof of the robustness of such structure when submitted to the recommended procedure from the Method 201A of the specified standard.