利用6SigmaET提高热模拟效率

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI:10.1109/SIITME53254.2021.9663718

A. Fodor, A. Taut, G. Chindris

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引用次数: 1

摘要

在这个时代，拥有可靠的电子产品是至关重要的，随着电子产品的发布时间缩短，确保电子产品的可靠性变得具有挑战性。本研究提出了一种通过在设计阶段包括定义良好的热模拟来提高电子产品可靠性的方法。因此，我们分析了6SigmaET软件工具的建模和仿真时间，以及定义热仿真设置所需的工作量。本文还证明了在产品开发阶段早期包括热模拟的重要性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Increasing Thermal Simulation Efficiency with 6SigmaET

It is of utmost importance to have reliable electronics in this day and age, and as release times for electronics have shortened, ensuring electronics reliability has become challenging. This study presents a method of increasing the reliability of an electronic product by including well-defined thermal simulations in the design stage. Thus, 6SigmaET software tool was analyzed for in reference to modelling and simulation times, and effort needed to define a thermal simulation setup. The paper also demonstrates the importance of including thermal simulations early in the development stages of a product.

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来源期刊

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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