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2022 International Conference on Electronics Packaging (ICEP)最新文献

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Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability 一级互连中的空洞及其对焊点可靠性的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795574
K. Lee, K. Oi, S. Lim, Yvonne Yeo, K. Sweatman, T. Ono, K. Murayama, S. Martell, H. Shimamoto, M. Tsuriya
{"title":"Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability","authors":"K. Lee, K. Oi, S. Lim, Yvonne Yeo, K. Sweatman, T. Ono, K. Murayama, S. Martell, H. Shimamoto, M. Tsuriya","doi":"10.23919/ICEP55381.2022.9795574","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795574","url":null,"abstract":"The presence of voids in first-level interconnects (FLI) is an unknown reliability concern. This paper presents the study of void formation in the interconnects, the inspection capability of void detection and the reliability impact of the voids in electromigration, thermal cycle and thermal shock tests. The first phase of this work has made it possible to define process recipes that can consistently build test packages with and without solder voids. X-ray inspection has been used to determine the level of voiding in the test packages. The second phase of this work has focused on subjecting the test packages to the said reliability tests. A comparison has been made between test packages with solder voids and test packages without solder voids. A conclusion that can be derived from the test data is that test packages with solder voids performed worse in solder joint reliability compared to test packages without solder voids.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"344 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127571411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of Amount of Heat Through Each Component of SiC Package Using CFD Analysis 基于CFD分析的SiC封装各部件的热量评估
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795488
T. Konishi, R. Kibushi, T. Hatakeyama, S. Nakagawa, M. Ishizuka
{"title":"Evaluation of Amount of Heat Through Each Component of SiC Package Using CFD Analysis","authors":"T. Konishi, R. Kibushi, T. Hatakeyama, S. Nakagawa, M. Ishizuka","doi":"10.23919/ICEP55381.2022.9795488","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795488","url":null,"abstract":"This paper describes the evaluation of amount of heat from the semiconductor die, which is a boundary condition for Electro-Thermal Analysis to evaluate the micro scale hot spots in power SiC MOSFET. Electro-Thermal Analysis is a method for identifying the nano or micro scale hot spots of semiconductor devices. In our previous study, the adiabatic boundary condition between the semiconductor die and the mold resin was employed in the Electro-Thermal Analysis. However, it is necessary to discuss whether heat dissipation from the semiconductor die to the mold resin should be considered. In this study, we discuss the validity of the adiabatic boundary condition between the semiconductor die and the mold resin using CFD analysis.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134103654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Post deposition treatment of thin film HfO2 dielectric for increased performance in MIM capacitors 用于提高MIM电容器性能的HfO2薄膜电介质沉积后处理
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795556
Alaric-Yohei Kawai Pétillot, S. Shoji, J. Mizuno
{"title":"Post deposition treatment of thin film HfO2 dielectric for increased performance in MIM capacitors","authors":"Alaric-Yohei Kawai Pétillot, S. Shoji, J. Mizuno","doi":"10.23919/ICEP55381.2022.9795556","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795556","url":null,"abstract":"Advanced packaging techniques such as heterogeneous packaging become crucial in reducing device sizes for high performance and reliability. For this reason, we require low temperature deposition and fabrication of high-quality thin films aimed towards heterogeneous integration. We propose a simple post deposition treatment of atomic layer deposited thin film dielectrics such as HfO2 using Atmospheric Plasma and Vacuum UV to increase its electrical characteristics. We found that the leak current is reduced by 40-86% for 10-40 nm thick Ar/O2 treated HfO2. XPS analysis reveals that either post deposition treatment greatly reduced carbon contaminants, and AES depth profiling shows the atmospheric plasma increasing oxygen presence on the surface of the HfO2 film.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122476439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples Sn-3.0Ag-0.5Cu/C194对的界面反应
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795609
Xinyue Hu, Jun-Bo Wen, Y. Yen
{"title":"Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples","authors":"Xinyue Hu, Jun-Bo Wen, Y. Yen","doi":"10.23919/ICEP55381.2022.9795609","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795609","url":null,"abstract":"The solid-liquid interfacial reactions between Sn- 3.0Ag-0.5Cu solder and C194 substrate reacted at 240, 255 and 270°C for 0.5, 1, 2, 4 and 8 h were investigated. Optical microscope, scanning electron microscope, and energy dispersive spectrometer were used to determine intermetallic compounds (IMCs). The results indicated that the Cu6Sn5 and Cu3Sn phases with a small Fe solubility were formed at the interface. The IMCs thickness was increased with the increased of the reaction times. The (Cu, Fe)6Sn5 phase was gradually detached from the C194, when the reaction temperature and time was increased.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116940767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of binders on the performance of copper sintering pastes 粘结剂对铜烧结浆料性能的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795555
Rodolfo Saccon, A. Benin, Sri Krishna Bhogaraju, G. Elger
{"title":"Effect of binders on the performance of copper sintering pastes","authors":"Rodolfo Saccon, A. Benin, Sri Krishna Bhogaraju, G. Elger","doi":"10.23919/ICEP55381.2022.9795555","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795555","url":null,"abstract":"Copper sintering materials easily oxidize at high temperature. Therefore, functional binders capable of reducing copper oxides in-situ, have low boiling point, leave no unwanted residues and help realizing stable paste formulation are desired. Among all binders investigated in the study, a high boiling point, glycol based binder, provided the best reducing capability and highest shear strength followed by lower boiling point alcohol based binders. α-terpineol gave the best printability, however provided no protection against oxidation during sintering. Short chain alcohols reveal to have a better reducing effect and the sintering is improved for low temperature sintering, but they are too volatile to be reliable.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116543794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays 表面改性对铝衬垫阵列超声键合的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795479
Pin Li, Yang-Chun Fan, Wallace Chuang, E. Schellkes, K. Yasuda, Jenn-Ming Song
{"title":"Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays","authors":"Pin Li, Yang-Chun Fan, Wallace Chuang, E. Schellkes, K. Yasuda, Jenn-Ming Song","doi":"10.23919/ICEP55381.2022.9795479","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795479","url":null,"abstract":"This study develops and optimizes Al-to-Al direct bonding for multi-level assembly using ultrasonic technique. Sputtered Al pads prepared by subtractive method were adopted. Effects of plasma pretreatment on joint strength are systematically investigated. Other than surface roughness and surface hardness, experimental results suggest that surface energy, which was affected by the plasma gas and input power, is the dominating factor for Al-Al direct bonding.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121243295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reduction of Sheet Resistance and Improvement of Radiation Efficiency by Annealing Treatment of ITO Transparent Antenna ITO透明天线退火处理降低片阻，提高辐射效率
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795379
Yuri Yamada, F. Koshiji, Y. Yasuda, T. Uchida, Katsumi Yamada
{"title":"Reduction of Sheet Resistance and Improvement of Radiation Efficiency by Annealing Treatment of ITO Transparent Antenna","authors":"Yuri Yamada, F. Koshiji, Y. Yasuda, T. Uchida, Katsumi Yamada","doi":"10.23919/ICEP55381.2022.9795379","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795379","url":null,"abstract":"In this study, the sheet resistance reduction of Indium Tin Oxide (ITO) transparent conductive films, which are utilized as the radiating elements, by annealing treatment was investigated to improve the radiation efficiency of monopole antennas using transparent conductive films. As a result, it was confirmed that the sheet resistance was significantly reduced and the radiation efficiency was improved to 72.23 % by increasing the film thickness and annealing","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125177869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder 常规无铅焊料与共晶锡铋焊料力学性能的比较
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795406
Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita
{"title":"Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder","authors":"Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita","doi":"10.23919/ICEP55381.2022.9795406","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795406","url":null,"abstract":"While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123725348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Study on Wiring and Mounting Structures for Smart Suits with Actuators 带执行器的智能套装布线与安装结构研究
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795521
Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh
{"title":"Study on Wiring and Mounting Structures for Smart Suits with Actuators","authors":"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh","doi":"10.23919/ICEP55381.2022.9795521","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795521","url":null,"abstract":"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122466089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages 三维x射线显微镜在扇形包装细线检测中的应用
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795636
Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin
{"title":"3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages","authors":"Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin","doi":"10.23919/ICEP55381.2022.9795636","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795636","url":null,"abstract":"Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"26 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130754419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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