3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages

Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin
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Abstract

Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.
三维x射线显微镜在扇形包装细线检测中的应用
在这里,我们报告样品制备和电气测试的失效分析。对2 μm / 2 μm细线和空间的扇出封装进行失效分析,利用三维x射线识别亚微米缺陷。FIB结果证实了缺陷小于1μm, 3D x射线能力在2 μm细线封装上是有用的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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