2022 International Conference on Electronics Packaging (ICEP)

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2022 International Conference on Electronics Packaging (ICEP) - 最新文献

Solder/solder joint for low temperature reflow by multi plating method

Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795414 Yoichi Maruo, D. Hashimoto, M. Kiso, Katsuhisa Tanabe, Yukinori Oda, S. Hashimoto

A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795597 HongWen Zhang, S. Lim, Samuel Lytwynec, Tyler Richmond, Tybarius Harter

Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795523 Zheng Zhang, A. Suetake, Chuantong Chen, O. Katayama, H. Ishino, Takeshi Endo, K. Sugiura, K. Tsuruta, K. Suganuma

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