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Post deposition treatment of thin film HfO2 dielectric for increased performance in MIM capacitors 用于提高MIM电容器性能的HfO2薄膜电介质沉积后处理
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795556
Alaric-Yohei Kawai Pétillot, S. Shoji, J. Mizuno
{"title":"Post deposition treatment of thin film HfO2 dielectric for increased performance in MIM capacitors","authors":"Alaric-Yohei Kawai Pétillot, S. Shoji, J. Mizuno","doi":"10.23919/ICEP55381.2022.9795556","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795556","url":null,"abstract":"Advanced packaging techniques such as heterogeneous packaging become crucial in reducing device sizes for high performance and reliability. For this reason, we require low temperature deposition and fabrication of high-quality thin films aimed towards heterogeneous integration. We propose a simple post deposition treatment of atomic layer deposited thin film dielectrics such as HfO2 using Atmospheric Plasma and Vacuum UV to increase its electrical characteristics. We found that the leak current is reduced by 40-86% for 10-40 nm thick Ar/O2 treated HfO2. XPS analysis reveals that either post deposition treatment greatly reduced carbon contaminants, and AES depth profiling shows the atmospheric plasma increasing oxygen presence on the surface of the HfO2 film.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122476439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays 表面改性对铝衬垫阵列超声键合的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795479
Pin Li, Yang-Chun Fan, Wallace Chuang, E. Schellkes, K. Yasuda, Jenn-Ming Song
{"title":"Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays","authors":"Pin Li, Yang-Chun Fan, Wallace Chuang, E. Schellkes, K. Yasuda, Jenn-Ming Song","doi":"10.23919/ICEP55381.2022.9795479","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795479","url":null,"abstract":"This study develops and optimizes Al-to-Al direct bonding for multi-level assembly using ultrasonic technique. Sputtered Al pads prepared by subtractive method were adopted. Effects of plasma pretreatment on joint strength are systematically investigated. Other than surface roughness and surface hardness, experimental results suggest that surface energy, which was affected by the plasma gas and input power, is the dominating factor for Al-Al direct bonding.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121243295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of Sn Solder Plating Containing Cellulose Nanofiber 含纤维素纳米纤维镀锡的研究进展
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795471
T. Kobayashi, A. Kogure, I. Shohji
{"title":"Development of Sn Solder Plating Containing Cellulose Nanofiber","authors":"T. Kobayashi, A. Kogure, I. Shohji","doi":"10.23919/ICEP55381.2022.9795471","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795471","url":null,"abstract":"We focused on low-cost and high-strength cellulose nanofibers (CNFs) as a substitute for Ag used for lead- free solder material. In this study, Sn/conductive CNF composite plating film was formed on a Cu plate after the CNFs were given electrical conductivity by sulfide reduction treatment. After plating, two Cu plates with the Sn/conductive CNF composite plating film were heated and joined to investigate the microstructure of the solder joint. It was found that conductive CNFs were incorporated into Sn plating films, while after joining, the conductive CNFs were agglomerated due to the melting of Sn.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127087593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Green Microfluidic Electrogenerated Chemiluminescence Device Using 9,10-Diphenylanthracene as a Host Material 以9,10-二苯基蒽为主体材料的绿色微流控电致发光装置
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795648
Emiri Kato, R. Ishimatsu, J. Mizuno, T. Kasahara
{"title":"Green Microfluidic Electrogenerated Chemiluminescence Device Using 9,10-Diphenylanthracene as a Host Material","authors":"Emiri Kato, R. Ishimatsu, J. Mizuno, T. Kasahara","doi":"10.23919/ICEP55381.2022.9795648","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795648","url":null,"abstract":"We propose a green microfluidic electrogenerated chemiluminescence (ECL) device using 9,10-diphenylanthracene (DPA), which is one of the most studied deep-blue ECL material, as a host material. The ECL solution was prepared by dissolving DPA in an organic solvent along with green guest and assist dopant materials. 5,12-Dibutyl-1,3,8,10-tetramethylquinacridone (TMDBQA) was used as the gust, while 4,4’-bis[4-(diphenylamino)- styryl]biphenyl (BDAVBi) was used as the assist dopant. The microfluidic device with the prepared solution exhibited bright green emission. The obtained ECL spectrum was found to be almost identical to the photoluminescence spectrum of TMDBQA, and no significant contributions from DPA and BDAVBi were observed in the spectrum. We expect that the DPA host solution is promising for the fabrication of highly luminescent ECL devices.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127702778","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of High Temperature and High Humidity Environment on Adhesion Strength of High Tg Epoxy Resin and Copper Joint 高温高湿环境对高Tg环氧树脂与铜接头粘接强度的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795399
X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi
{"title":"Effect of High Temperature and High Humidity Environment on Adhesion Strength of High Tg Epoxy Resin and Copper Joint","authors":"X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi","doi":"10.23919/ICEP55381.2022.9795399","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795399","url":null,"abstract":"In this study, the Cu joint with a new high Tg epoxy resin was used as the research object. Tensile test, fracture surface observation and XPS analysis for fracture surface were performed using Cu/resin joints after high temperature and high humidity aging treatment under different conditions. The effect of aging on the adhesion strength and fracture mode of the Cu/resin joint was investigated. The analyzed results indicated that the adhesion strength of Cu/resin joint decreased with an increase in the aging time and aging temperature. Fracture mainly occurred at the Cu/resin and partially occurred at the Cu oxide formed in the surface of Cu.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127450809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples Sn-3.0Ag-0.5Cu/C194对的界面反应
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795609
Xinyue Hu, Jun-Bo Wen, Y. Yen
{"title":"Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples","authors":"Xinyue Hu, Jun-Bo Wen, Y. Yen","doi":"10.23919/ICEP55381.2022.9795609","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795609","url":null,"abstract":"The solid-liquid interfacial reactions between Sn- 3.0Ag-0.5Cu solder and C194 substrate reacted at 240, 255 and 270°C for 0.5, 1, 2, 4 and 8 h were investigated. Optical microscope, scanning electron microscope, and energy dispersive spectrometer were used to determine intermetallic compounds (IMCs). The results indicated that the Cu6Sn5 and Cu3Sn phases with a small Fe solubility were formed at the interface. The IMCs thickness was increased with the increased of the reaction times. The (Cu, Fe)6Sn5 phase was gradually detached from the C194, when the reaction temperature and time was increased.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116940767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of MEMS Structures for Miniature Organic Rankine Cycle System 微型有机朗肯循环系统MEMS结构的研制
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795548
M. Kaneko, Kenji Takeda, M. Aibara, F. Uchikoba
{"title":"Development of MEMS Structures for Miniature Organic Rankine Cycle System","authors":"M. Kaneko, Kenji Takeda, M. Aibara, F. Uchikoba","doi":"10.23919/ICEP55381.2022.9795548","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795548","url":null,"abstract":"This paper proposes a MEMS (Micro Electro Mechanical Systems) turbine as an organic Rankine cycle (ORC) system for an IoT (Internet of Things) edge device. The developing turbine shows millimeter scale, and it employs a low-boiling-point material as a working fluid. Therefore, this ORC system can harvest the low temperature waste heat energy. The developed MEMS turbine showed power generation with a winding wire 3-phase coil. When the heating temperature was 80 degree Celsius, the pressure was 0.28 MPa, the rotational speed was 109,090 rpm. The maximum output power was 968.5 micro VA when a load resistance was 0.5 ohm at each coil.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"133 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124021028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel thermosetting low Dk/Df film and its performance 新型热固性低Dk/Df薄膜及其性能
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795447
M. Koh, Kazuyoshi Yoneda, Kazutaka Nakada, Shoya Sekiguchi, Shoko Mishima, N. Ishikawa, T. Ogata
{"title":"Novel thermosetting low Dk/Df film and its performance","authors":"M. Koh, Kazuyoshi Yoneda, Kazutaka Nakada, Shoya Sekiguchi, Shoko Mishima, N. Ishikawa, T. Ogata","doi":"10.23919/ICEP55381.2022.9795447","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795447","url":null,"abstract":"We have developed novel thermosetting low Dk/Df film for 5G application by using novel curable PPE. It showed low Dk, 3.1 at 10GHz, and low Df, 0.001 at 10GHz, high Tg, 200°C, low CTE, 18ppm and low water absorption 0.04%. And it showed good laser via process ability and good adhesion to Electroless plated Cu. We have made stacked substrate with L/S=15μm/15μm comb electrode and B-HAST test was conducted, and it showed good endurance. Transmission loss of the film was better than that of existing epoxy type low Df film.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124090060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimation of Switching Transients and Power Losses of SiC-based Power MOSFET Inverter Using Electromagnetic-circuit Co-simulation during Six-step Commutation 六步换相过程中基于sic的功率MOSFET逆变器开关瞬态和功率损耗的电磁电路联合仿真
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795500
Yan-Cheng Liu, Hsien-Chie Cheng, Hsin-Han Lin, Shian-Chiau Chiou, Shengyu Wu, T. Chang
{"title":"Estimation of Switching Transients and Power Losses of SiC-based Power MOSFET Inverter Using Electromagnetic-circuit Co-simulation during Six-step Commutation","authors":"Yan-Cheng Liu, Hsien-Chie Cheng, Hsin-Han Lin, Shian-Chiau Chiou, Shengyu Wu, T. Chang","doi":"10.23919/ICEP55381.2022.9795500","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795500","url":null,"abstract":"This study conducts power loss estimation of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) inverter in 1200V 200A power module during space-vector pulse width modulation (SVPWM) load operation using a fully integrated electromagnetic (EM)-circuit simulation. The focus of this study is placed on the switching transients of the SiC power MOSFET devices and the power losses of the SiC MOSFET inverter, including switching, conduction, diode, and reverse recovery losses. In addition, the effect of the parasitic inductances and capacitances of the SiC inverter on the switching transients and power losses are taken into account, and the values of which are calculated through Q3D Extractor under a working frequency of 1 MHz. The simulated parasitic inductances and switching waveforms are verified by the DPT experiment according to the IEC criterion. Moreover, an integrated circuit model of the SiC inverter is built to perform SVPWM switching at 400V drain bias and 30A load current, where the switching frequency and duty cycle are 15 kHz and 66%, respectively. Finally, the switching frequency effect on the power losses of the SiC inverter during load cycles is examined through parametric analysis.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116939673","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impact of Backside Defects on Device Characteristics of Ultra-Thin DRAMs with 3-5 μm Si Wafers for Bumpless Build Cube (BBCube) Application 背面缺陷对3-5 μm Si晶圆超薄dram器件特性的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795532
Z. Chen, N. Araki, Y. Kim, T. Fukuda, K. Sakui, T. Nakamura, T. Kobayashi, T. Obara, T. Ohba
{"title":"Impact of Backside Defects on Device Characteristics of Ultra-Thin DRAMs with 3-5 μm Si Wafers for Bumpless Build Cube (BBCube) Application","authors":"Z. Chen, N. Araki, Y. Kim, T. Fukuda, K. Sakui, T. Nakamura, T. Kobayashi, T. Obara, T. Ohba","doi":"10.23919/ICEP55381.2022.9795532","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795532","url":null,"abstract":"To clarify the impact of backside defects on the device characteristics during wafer ultra-thinning, 20 nm-node DRAM Si wafers were thinned down to a thickness of 3-5 μm and evaluated. The dependences of the DRAM characteristics on the depth of backside defects, Si thickness, and chip position within a 300-mm wafer are described.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125367375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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