{"title":"高温高湿环境对高Tg环氧树脂与铜接头粘接强度的影响","authors":"X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi","doi":"10.23919/ICEP55381.2022.9795399","DOIUrl":null,"url":null,"abstract":"In this study, the Cu joint with a new high Tg epoxy resin was used as the research object. Tensile test, fracture surface observation and XPS analysis for fracture surface were performed using Cu/resin joints after high temperature and high humidity aging treatment under different conditions. The effect of aging on the adhesion strength and fracture mode of the Cu/resin joint was investigated. The analyzed results indicated that the adhesion strength of Cu/resin joint decreased with an increase in the aging time and aging temperature. Fracture mainly occurred at the Cu/resin and partially occurred at the Cu oxide formed in the surface of Cu.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of High Temperature and High Humidity Environment on Adhesion Strength of High Tg Epoxy Resin and Copper Joint\",\"authors\":\"X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi\",\"doi\":\"10.23919/ICEP55381.2022.9795399\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, the Cu joint with a new high Tg epoxy resin was used as the research object. Tensile test, fracture surface observation and XPS analysis for fracture surface were performed using Cu/resin joints after high temperature and high humidity aging treatment under different conditions. The effect of aging on the adhesion strength and fracture mode of the Cu/resin joint was investigated. The analyzed results indicated that the adhesion strength of Cu/resin joint decreased with an increase in the aging time and aging temperature. Fracture mainly occurred at the Cu/resin and partially occurred at the Cu oxide formed in the surface of Cu.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795399\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of High Temperature and High Humidity Environment on Adhesion Strength of High Tg Epoxy Resin and Copper Joint
In this study, the Cu joint with a new high Tg epoxy resin was used as the research object. Tensile test, fracture surface observation and XPS analysis for fracture surface were performed using Cu/resin joints after high temperature and high humidity aging treatment under different conditions. The effect of aging on the adhesion strength and fracture mode of the Cu/resin joint was investigated. The analyzed results indicated that the adhesion strength of Cu/resin joint decreased with an increase in the aging time and aging temperature. Fracture mainly occurred at the Cu/resin and partially occurred at the Cu oxide formed in the surface of Cu.
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