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Electrical Performance Analysis for Bridge Die Package Solution 桥接模具封装方案电气性能分析
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795578
Po-Chih Pan, Fu-Cheng Chu, H. Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen Chao Wang
{"title":"Electrical Performance Analysis for Bridge Die Package Solution","authors":"Po-Chih Pan, Fu-Cheng Chu, H. Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen Chao Wang","doi":"10.23919/ICEP55381.2022.9795578","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795578","url":null,"abstract":"High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design patterns, and the analyses are including measurement and SI simulation. The S-Parameter measurement and simulation will be performed. Finally, the result shows a good correlation on bridge die package platform.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121100323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Binder Chemistry on Bonding Properties of a Flexible Conductive Adhesive Containing Silver-plated Aluminum Fillers 粘结剂化学性质对含镀银铝填料的柔性导电粘结剂粘结性能的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795487
T. Fukushima, M. Inoue
{"title":"Effect of Binder Chemistry on Bonding Properties of a Flexible Conductive Adhesive Containing Silver-plated Aluminum Fillers","authors":"T. Fukushima, M. Inoue","doi":"10.23919/ICEP55381.2022.9795487","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795487","url":null,"abstract":"The effect of the binder chemistry on bonding strength and interfacial contact resistivity of flexible electrical conductive adhesives composed of polyhydroxyurethane-based binders and copper electrodes was investigated. The bonding strength with a copper substrate was increased by decreasing the molecular weight of the polyurethane binder and depended on the molecular structure of isocyanate cross-linkers, which were mixed into the binder. In addition, the isocyanate cross-linker was found to affect to increase the interfacial electrical resistance with copper electrodes. These results suggest that binder chemistry influences bonding properties.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"2003 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125772379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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