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Novel Method for Measuring High Temperature Hygroscopic Swelling 测量高温吸湿性溶胀的新方法
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795598
I. Chin, W. K. Loh, Mohd Zulkifly Bin Abdullah
{"title":"Novel Method for Measuring High Temperature Hygroscopic Swelling","authors":"I. Chin, W. K. Loh, Mohd Zulkifly Bin Abdullah","doi":"10.23919/ICEP55381.2022.9795598","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795598","url":null,"abstract":"Electronic packaging reliability is known to be affected by humidity from the environment. Absorbed moisture can cause serious assembly issues such as warpage, delamination, and even pop-corning. However, to this day, material moisture properties are not readily available - especially at high temperatures. This paper introduces a novel method of measuring high temperature material swelling to extend the characterization capability beyond typical measurement limits. This new measurement concept has yielded some promising results and presents opportunities for future work.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134209993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Theoretical Study on Insulation Reliability of Copper Circuits on Silver-Seed Layer 银种层上铜电路绝缘可靠性的理论研究
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795418
Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda
{"title":"Theoretical Study on Insulation Reliability of Copper Circuits on Silver-Seed Layer","authors":"Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda","doi":"10.23919/ICEP55381.2022.9795418","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795418","url":null,"abstract":"Mechanism of high insulation reliability of the circuits fabricated on silver-seed layer was investigated by the electrochemical measurement. The dissolution behavior of constituent metal of silver seed plating system (combination of silver and copper) showed the suppression of silver dissolution by existence of copper. Furthermore, it is also confirmed that the existence of silver does not accelerate the copper dissolution. We concluded that these metal dissolution behaviors play an important role in improving the insulation reliability of copper circuits on silver-seeds.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134454123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders Sn-Bi-Ag低温无铅焊料的力学性能
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795572
Chih-han Yang, Yu-Chen Liu, Y. Hirata, H. Nishikawa, S. Lin
{"title":"Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders","authors":"Chih-han Yang, Yu-Chen Liu, Y. Hirata, H. Nishikawa, S. Lin","doi":"10.23919/ICEP55381.2022.9795572","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795572","url":null,"abstract":"We designed low-temperature tin-bismuth-silver (Sn-Bi-Ag, SBA) solder by CALculation of PHAse Diagram (CALPHAD)-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to suppress bismuth (Bi)-rich phase width growth, while keeping their low melting temperatures. This study shows that CALPHAD calculations make a good agreement with experimental results in phase fraction, melting point, and paths of solidification. As for the tensile properties of the SBA solder in as-cast, high yield strength (YS), high ultimate tensile strength (UTS), and slightly better elongation than the conventional Sn-58Bi solder were obtained. After being thermally aged, higher strength and same elongation level of Sn-58Bi were observed.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133177774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multi-Objective Design Optimization of Power Module Performances 电源模块性能的多目标设计优化
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795531
A. Nakamura, M. Yoshida, T. Miyashita
{"title":"Multi-Objective Design Optimization of Power Module Performances","authors":"A. Nakamura, M. Yoshida, T. Miyashita","doi":"10.23919/ICEP55381.2022.9795531","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795531","url":null,"abstract":"As next-generation power modules develop with three-dimensional wiring structures and high-speed switching schemes, strategies to reduce the parasitic inductance and temperature will be essential to meet the increasingly demanding workloads. In this study, we developed a multi-objective design optimization system for power modules and rendered Pareto solutions outlining the inductance of the path between the main terminals, the total inductance of the paths between the control terminals, and the surface temperature of the path between the main terminals, being useful to design power modules with utmost thermal and inductance performance.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124332188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Artificial Spinal Cord IC with Pulse-Type Hardware Neural Networks Mimicking Function of The Spinal Cord 具有脉冲型硬件神经网络模拟脊髓功能的人工脊髓集成电路
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795499
Kenji Takeda, Mikihito Hayakawa, Motokuni Ishibashi, Takumi Ishihama, Minori Ishihara, Megumi Aibara, M. Kaneko, Ken Saito, F. Uchikoba
{"title":"Artificial Spinal Cord IC with Pulse-Type Hardware Neural Networks Mimicking Function of The Spinal Cord","authors":"Kenji Takeda, Mikihito Hayakawa, Motokuni Ishibashi, Takumi Ishihama, Minori Ishihara, Megumi Aibara, M. Kaneko, Ken Saito, F. Uchikoba","doi":"10.23919/ICEP55381.2022.9795499","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795499","url":null,"abstract":"An artificial spinal cord IC for motor neuron control using an analog CMOS circuit instead of a conventional digital system is reported. A circuit configuration was proposed for P-HNNs for quadrupedal walking control to enable reflex movements by sensors. It was shown that the gait pattern was changed by actual measurement. Pulse-type hardware neural networks (P-HNNs) were proposed to control human biped gait. The proposed circuit was confirmed to generate walking and running patterns.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125822451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparing various test environments for conformal coating evaluation 比较不同测试环境对涂层适形评定的影响
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795654
P. Singh, L. Palmer, M. Šmith, D. Citrin, A. Locquet, D. Hampannavar, H. Fu, M. M. Khaw, Kee-Leong Tan, C. Xu, J. Kaufman, M. Pudas, H. Schweigart, S. Strixner, M. Meier, C. Wang, H. Akbari
{"title":"Comparing various test environments for conformal coating evaluation","authors":"P. Singh, L. Palmer, M. Šmith, D. Citrin, A. Locquet, D. Hampannavar, H. Fu, M. M. Khaw, Kee-Leong Tan, C. Xu, J. Kaufman, M. Pudas, H. Schweigart, S. Strixner, M. Meier, C. Wang, H. Akbari","doi":"10.23919/ICEP55381.2022.9795654","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795654","url":null,"abstract":"Flowers of sulfur testing of conformal coatings is well researched and established. However, the electronics industry has a long history of testing based on mixed-flowing gas environments. This work compares the results of testing three commonly available conformal coatings using the flowers of sulfur, the mixed flowing gas and the iodine vapor tests. Serpentine thin films of copper and silver were coated with the conformal coatings under test and the corrosion rates of the underlying thin films were measured by electrical means in the flowers of sulfur and the mixed-flowing gas environments. In the iodine vapor test the extent of thin film corrosion was visually evaluated. The extent of corrosion of the metal films was used as a measure of the conformal coating performance. The three test results were in qualitative agreement.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"674 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127003309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reliability of Sintered Cu Joint on Cu Substrate with or without Ag Metallization 镀银或未镀银铜基烧结铜接头的可靠性
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795536
M. Hsieh, A. Suetake, Zheng Zhang, Rieko Okumura, K. Anai, K. Suganuma
{"title":"Reliability of Sintered Cu Joint on Cu Substrate with or without Ag Metallization","authors":"M. Hsieh, A. Suetake, Zheng Zhang, Rieko Okumura, K. Anai, K. Suganuma","doi":"10.23919/ICEP55381.2022.9795536","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795536","url":null,"abstract":"Metallic sintering paste, such as silver and copper paste, attracts great attention because of their better performance in next generation wide band gap power device while in comparison with conventional lead-free solder paste [1], [2]. Technologies of metallic sintering paste have been developed to fulfill the severe requirement of next generation wide bandgap high power devices. As copper paste has high thermal conductivity comparing with the conventional lead-free solder and is more cost-friendly than silver paste, together with SiC chip pricing is getting more affordable, it is worthwhile to assess the possibility of applying copper paste onto general electronic devices as well as high power devices. In the present study, the authors investigated the reliability of pressure- assistant sintering copper joint between SBD SiC chips and copper substrates without any metallization (bare copper) and with silver metallization on substrate surface after thermal cycles between -55 °Cx 30 min and 150 °Cx 30 min. Both silver metallized and bare copper substrates had no change at the joint part even after 1000 thermal cycles and showed high reliability. Result of both bare copper and silver metallized samples after power cycles are also discussed. As for power cycle test results, copper sintering joint remains no change even after the wiring portion burned out after over 10000 cycles. Both results indicate copper paste is suitable for electronics with copper and/or silver surface substrate.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127004194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design Optimization of Fin Shape of Heat Sinks for Enhanced Cooling Performance 提高散热性能的散热器翅片形状优化设计
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795403
Hikaru Igarashi, M. Hirota, M. Yoshida, T. Miyashita
{"title":"Design Optimization of Fin Shape of Heat Sinks for Enhanced Cooling Performance","authors":"Hikaru Igarashi, M. Hirota, M. Yoshida, T. Miyashita","doi":"10.23919/ICEP55381.2022.9795403","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795403","url":null,"abstract":"Heat sinks are well-known mechanisms aiding to dissipate heat efficiently. In this study, we designed and evaluated the cooling performance of heat sinks with diverse fin geometries, base materials, and fans. Also, we optimized the performance by using design optimization of the variables related to the shape of fins. Thus, by changing the fin geometries of the heat sink, adding trenches to the straight fins, and the related modifications, it was found that the optimized heat sink achieves a higher cooling performance than the (baseline) straight-fin heat sink. We also investigated the relationship between the depth of the trench and the cooling performance to find the optimal parameters.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126697531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electrochemical analysis of initial oxide layers on copper surface 铜表面初始氧化层的电化学分析
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795651
Chi-Hsuan Lin, Wei-ting Chen, Y. Ke, Jenn-Ming Song, K. Yasuda
{"title":"Electrochemical analysis of initial oxide layers on copper surface","authors":"Chi-Hsuan Lin, Wei-ting Chen, Y. Ke, Jenn-Ming Song, K. Yasuda","doi":"10.23919/ICEP55381.2022.9795651","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795651","url":null,"abstract":"In this study, coulometric reduction method was adopted to investigate the phase and thickness of surface oxide layer of sputtered copper. The samples subjected to citric acid wash and room temperature storage were investigated. Repeated reduction tests in NaOH solution was also carried out to explore the very early state of the copper surface. According to the reduction potential ranging from -0.62 to 0.65 V, the initial oxide formed in NaOH solution was CuO with the thickness of around 1.1~1.2 nm.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131964939","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step process 两步法制备低温Cu/SiO2杂化键合
2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI: 10.23919/ICEP55381.2022.9795579
J. Ong, W. Chiu, O. Lee, Hsiang-Hung Chang, Chih-Huang Chen
{"title":"Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step process","authors":"J. Ong, W. Chiu, O. Lee, Hsiang-Hung Chang, Chih-Huang Chen","doi":"10.23919/ICEP55381.2022.9795579","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795579","url":null,"abstract":"In this investigation, die-to-die Cu/SiO2 hybrid bonding can be well bonded and obtain excellent bonding strength with Ar plasma pretreatment. The diameter of the microbumps is 8 μm along with 20 μm pitch. Results show that Cu joints can be well bonded under 150 °C ~ 200 °C for 1h in vacuum ambient after water fusion bonding followed by postbonding annealing at 175 °C~200 °C without any external pressure. Cross-sectional electron analysis shows no oxide bonding interface along 150 μm long and no gaps or cracks observed in Cu bonding. Bonding strength was measured by pull tests.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130283319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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