铜表面初始氧化层的电化学分析

Chi-Hsuan Lin, Wei-ting Chen, Y. Ke, Jenn-Ming Song, K. Yasuda
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引用次数: 0

摘要

本研究采用库仑还原法对溅射铜表面氧化层的物相和厚度进行了研究。对样品进行了柠檬酸洗涤和室温保存的研究。在NaOH溶液中进行了多次还原试验,以探索铜表面的早期状态。根据还原电位在-0.62 ~ 0.65 V范围内,NaOH溶液中形成的初始氧化物为CuO,厚度约为1.1~1.2 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrochemical analysis of initial oxide layers on copper surface
In this study, coulometric reduction method was adopted to investigate the phase and thickness of surface oxide layer of sputtered copper. The samples subjected to citric acid wash and room temperature storage were investigated. Repeated reduction tests in NaOH solution was also carried out to explore the very early state of the copper surface. According to the reduction potential ranging from -0.62 to 0.65 V, the initial oxide formed in NaOH solution was CuO with the thickness of around 1.1~1.2 nm.
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