Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda
{"title":"银种层上铜电路绝缘可靠性的理论研究","authors":"Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda","doi":"10.23919/ICEP55381.2022.9795418","DOIUrl":null,"url":null,"abstract":"Mechanism of high insulation reliability of the circuits fabricated on silver-seed layer was investigated by the electrochemical measurement. The dissolution behavior of constituent metal of silver seed plating system (combination of silver and copper) showed the suppression of silver dissolution by existence of copper. Furthermore, it is also confirmed that the existence of silver does not accelerate the copper dissolution. We concluded that these metal dissolution behaviors play an important role in improving the insulation reliability of copper circuits on silver-seeds.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Theoretical Study on Insulation Reliability of Copper Circuits on Silver-Seed Layer\",\"authors\":\"Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda\",\"doi\":\"10.23919/ICEP55381.2022.9795418\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Mechanism of high insulation reliability of the circuits fabricated on silver-seed layer was investigated by the electrochemical measurement. The dissolution behavior of constituent metal of silver seed plating system (combination of silver and copper) showed the suppression of silver dissolution by existence of copper. Furthermore, it is also confirmed that the existence of silver does not accelerate the copper dissolution. We concluded that these metal dissolution behaviors play an important role in improving the insulation reliability of copper circuits on silver-seeds.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795418\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795418","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Theoretical Study on Insulation Reliability of Copper Circuits on Silver-Seed Layer
Mechanism of high insulation reliability of the circuits fabricated on silver-seed layer was investigated by the electrochemical measurement. The dissolution behavior of constituent metal of silver seed plating system (combination of silver and copper) showed the suppression of silver dissolution by existence of copper. Furthermore, it is also confirmed that the existence of silver does not accelerate the copper dissolution. We concluded that these metal dissolution behaviors play an important role in improving the insulation reliability of copper circuits on silver-seeds.
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