Design Consideration of 3D Power SoC Using Virtual Prototyping

Abstract

3D power supply on chip (3D power SoC), which integrates Si based IC, Gallium Nitride (GaN) power devices and passive devices realizes high efficiency at high frequency switching and high-power density. Miniaturization makes 3D power SoC high temperature, thus, we have to take into consideration of the temperature effect when we design 3D power SoC. In this paper, we propose a virtual prototyping technique, which is coupling of thermal-device, heat conduction, thermal-electromagnetic, and thermal-circuit simulation to design the 3D power supply on chip.