粘结剂对铜烧结浆料性能的影响

Rodolfo Saccon, A. Benin, Sri Krishna Bhogaraju, G. Elger
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引用次数: 0

摘要

铜烧结材料在高温下容易氧化。因此,需要能够原位还原氧化铜,沸点低,不留下多余残留物,有助于实现稳定膏体配方的功能粘合剂。在研究的所有粘合剂中,高沸点的乙二醇基粘合剂具有最佳的还原能力和最高的剪切强度,其次是低沸点的醇基粘合剂。α-松油醇具有最佳的印刷性能,但在烧结过程中没有提供抗氧化保护。短链醇具有较好的还原效果,低温烧结时烧结性能得到改善,但其挥发性大,可靠性不高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of binders on the performance of copper sintering pastes
Copper sintering materials easily oxidize at high temperature. Therefore, functional binders capable of reducing copper oxides in-situ, have low boiling point, leave no unwanted residues and help realizing stable paste formulation are desired. Among all binders investigated in the study, a high boiling point, glycol based binder, provided the best reducing capability and highest shear strength followed by lower boiling point alcohol based binders. α-terpineol gave the best printability, however provided no protection against oxidation during sintering. Short chain alcohols reveal to have a better reducing effect and the sintering is improved for low temperature sintering, but they are too volatile to be reliable.
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