常规无铅焊料与共晶锡铋焊料力学性能的比较

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795406

Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita

{"title":"常规无铅焊料与共晶锡铋焊料力学性能的比较","authors":"Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita","doi":"10.23919/ICEP55381.2022.9795406","DOIUrl":null,"url":null,"abstract":"While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder\",\"authors\":\"Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita\",\"doi\":\"10.23919/ICEP55381.2022.9795406\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795406\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795406","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

虽然基于锡铋合金系统的焊料合金适用于低温焊接应用，但在微观结构和机械性能方面仍有一系列需要了解的考虑因素。本研究比较了一种共晶Sn-Bi合金与一系列常规无铅钎料合金的力学性能的应变速率依赖性。讨论了影响低温焊料合金发展的重要差异。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder

While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2022 International Conference on Electronics Packaging (ICEP)

自引率

0.00%

发文量