Faisal Alsaif, Yue Zhang, Nihanth Adina, Khalid Alkhalid, Jin Wang
{"title":"Series Compensation for DC Microgrid Stabilization Utilizing T-Type Modular Dc Circuit Breaker","authors":"Faisal Alsaif, Yue Zhang, Nihanth Adina, Khalid Alkhalid, Jin Wang","doi":"10.1109/WiPDA56483.2022.9955249","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955249","url":null,"abstract":"Dc microgrids during voltage transients or load power changes are prone to instability due to the negative impedance characteristics of the constant power loads (CPLs). The newly proposed T-Type Modular Dc Circuit Breaker (T-Breaker) integrates current breaking, current limiting and grid transient compensation functions into one device thanks to its integrated energy storage and modular multilevel converter structures. Much like the current and voltage compensations in ac systems, the T-Breaker can help the ride-through of grid transients by implementing shunt (current) and series (voltage) compensations. This paper focuses on the series compensation function of the T-Breaker which can insert or absorb voltage. Related system modeling, small signal analysis, large signal analysis, simulation are presented here. Experimental validation result on a scaled down system is also presented to show how the compensation improves the microgrid’s stability.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127132307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Hsu, C. Yen, Hsiang-Ting Hung, Guan-Wei Lin, Chih-Feng Huang, Lung-Sheng Lin, I-Chi Lin, Chih-Fang Huang, Ta-Yung Yang
{"title":"A Highly Integrated Sensorless Field Oriented Control BLDC / PMSM Inverter with 99% Efficiency Enabled by an All-in-one System Integrated Full SiC Intelligent Power Module (sIPM®)","authors":"F. Hsu, C. Yen, Hsiang-Ting Hung, Guan-Wei Lin, Chih-Feng Huang, Lung-Sheng Lin, I-Chi Lin, Chih-Fang Huang, Ta-Yung Yang","doi":"10.1109/WiPDA56483.2022.9955268","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955268","url":null,"abstract":"SiC MOSFETs are a beneficial solution in motor inverter applications because of their remarkable intrinsic diode reverse recovery behavior. SiC MOSFETs have successfully emerged as the best choice as devices for realizing high performance and high power motor drive in, for example, electric vehicles, but have rarely been used in low power motor drive for applications. In this work, an all-in-one system integrated SiC intelligent power module, which integrates the MCU, memory, SRAM, motor control library, ADC, DAC, gate drivers, and SiC MOSFETs was proposed to explore the benefits and potential of SiC MOSFETs in highly integrated BLDC/PMSM motor drive. As a result, SiC solution generally saves over 80% of space, improves the thermal performance by 27.7°C, and enhances 3% of efficiency compared to the silicon counterparts.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131165259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Riar, J. Ewanchuk, Hailing Wu, Yue Zhang, Xiao Li, Dihao Ma, Rob Borjas, Jin Wang
{"title":"Thermal Design and Experimental Evaluation of a 1kV, 500A T-Type Modular DC Circuit Breaker","authors":"B. Riar, J. Ewanchuk, Hailing Wu, Yue Zhang, Xiao Li, Dihao Ma, Rob Borjas, Jin Wang","doi":"10.1109/WiPDA56483.2022.9955276","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955276","url":null,"abstract":"This paper presents thermal design of a 1kV, 500A T-type modular DC circuit breaker. Along with the thermal design, which determines the trip/protection curve of the breaker, experimental results of the breaker are also presented in this paper. The breaker is over 99.5% efficient that is evaluated using both thermal measurements and millivolt meter for improving the accuracy of measurements. In addition, experimental results shows that T-breaker can break a fault current of up to 4.24 kA, which is approximately equal to 8.5 times its rated current.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114675183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Samani, Juncheng Lu, Ignacio Galiano Zurbriggen
{"title":"Next Generation of GaN Single-Board High Power Stages","authors":"R. Samani, Juncheng Lu, Ignacio Galiano Zurbriggen","doi":"10.1109/WiPDA56483.2022.9955306","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955306","url":null,"abstract":"Insulated metal substrate (IMS) boards have been widely used in industry for their remarkable electrical and thermal performance. However, the IMS boards require a separate driver board that affects the power density. With Gallium Nitride enhancement-mode high electron mobility transistors (GaN E-HEMTs) being adopted in modern power converters, power density is becoming critical more than ever. This paper proposes the next generation of single-board IMS power stages (i.e., IMS4). In this board, the power board and the driver board are embedded into a single board. Furthermore, a CerStrate™ ceramic substrate single-board solution is proposed that maintains the exact electrical specifications as observed in IMS4 and significantly enhances the thermal performance. The superiority of these single-board solutions is verified through finite element analysis (FEA) simulations and experiments.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121820681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Dominik Koch, Ankit Sharma, T. Huesgen, I. Kallfass
{"title":"Comparison of Thermally Optimized SMD Packages for 100 V GaN HEMTs in 300 kHz Buck Converter High Current Applications","authors":"Dominik Koch, Ankit Sharma, T. Huesgen, I. Kallfass","doi":"10.1109/WiPDA56483.2022.9955270","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955270","url":null,"abstract":"In this work an approach for a direct experimental comparison of the application-oriented performance between two high current GaN DC/DC converters based on 7mΩ, 100V GaN HEMTs in a commercial off-the-shelf top-cooled package and 5mΩ, 100V GaN HEMTs embedded in a thermally-optimized single-chip package is given. The two packaging versions are compared by a maximally identical implementation of the power and gate loops in a 48V, 300kHz buck converter with two parallel GaN HEMTs. In the single-chip package the die is directly mounted on a 12×6mm2 copper-heat spreader offering a significantly lower thermal resistance to heatsink (1.69KW−1) in comparison to the commercial off-the-shelf version (2.45KW−1). For a direct benchmark, the COTS-based converter has an identical power-loop to the SCP-version with a novel gate-drive concept. Both versions have an efficiency of 96.8% at 65A output current (output power: 1.5kW), while the commercial off-the-shelf version has a better efficiency for lower currents, due to its better hard-switching Figure-of-Merits and therefore lower switching losses and reaches an output current of up to 80A (output power: 1.75kW). A detailed analytical loss breakdown for the different transistors in dependence of the temperature and output current is given to proof the measured current point, where the efficiencies of both converters are identical, since the higher switching losses of the SCP version are compensated by lower conduction losses at higher currents and temperatures compared to the smaller COTS transistor. Finally, an outlook on further improvements for reaching higher output currents and potential converters for a more fair comparison of different thermally optimized SMD packages are given.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"153 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123056607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Moench, R. Reiner, Kareem Mansour, M. Basler, P. Waltereit, R. Quay, K. Bartholomé
{"title":"GaN Power Converter Applied to Electrocaloric Heat Pump Prototype and Carnot Cycle","authors":"S. Moench, R. Reiner, Kareem Mansour, M. Basler, P. Waltereit, R. Quay, K. Bartholomé","doi":"10.1109/WiPDA56483.2022.9955287","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955287","url":null,"abstract":"A 99% efficient power converter is applied to an electrocaloric heat pump prototype for the first time, enabling cyclic electrical field variation in electrocaloric capacitors and high heat pump performance. The electrocaloric effect is an almost fully reversible temperature change in special dielectrics caused by changed electrical field. The GaN power converter achieves high efficiency by zero-voltage switching hysteretic current control. Blocks of commercial multi-layer ceramic capacitors which exhibit an electrocaloric effect are efficiently charged and discharged, synchronized to contacting to a heat sink and source by actuators, which forms a heat pump prototype. Brayton cycles are caused by trapezoidal voltage. Then, arbitrary voltage (E-field) variation for Carnot-like cycles with quasi-isothermal heat transfer is demonstrated and verified by the measured almost constant heat flux during contact to the heat sink. The performance of electrocaloric heat pump prototypes in literature was limited by losses of LC resonant circuits, and is improved by an up to 15.5-fold decrease by this work. The work demonstrates electrocalorics as an emerging power electronics application and contributes to realize future efficient and emission-free, solid state, and electrocaloric heat pump systems.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127511368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Compact Three-Level GaN Power Module Suitable for Active-Neutral-Point-Clamped (ANPC) Three-Level Converter","authors":"Ziwei Liang, Liyan Zhu, Hua Bai, Yue Sun","doi":"10.1109/WiPDA56483.2022.9955289","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955289","url":null,"abstract":"This paper presents a compact three-level (3L) Gallium Nitride (GaN) power module with low parasitic parameters. The power loop, gate loop and PCB layout are designed and optimized carefully to achieve: 1) low parasitic parameters; 2) good thermal performance; 3) compact size and high integration; 4) easy utilization on building 3L ANPC converter. To achieve higher power rating, for two high-frequency (HF) switch legs, three GaN Systems’ GS665016T are paralleled and for the low-frequency pair, two switches are paralleled considering the much lower switching loss. The decoupling capacitors, driver circuits and auxiliary power supplies are all integrated into the module for the easy utilization and small parasitics. Double-pulse test (DPT) is applied to test the electrical characteristics and a bidirectional three-phase 3L ANPC converter is built using the proposed modules to verify the electrical performance and thermal performance.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128280366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design Optimization and Surge Current Capability of 4H-SiC Lateral Deep P+ JBS Diode on Thin RESURF Layer","authors":"Atsushi Shimbori, A. Q. Huang","doi":"10.1109/WiPDA56483.2022.9955046","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955046","url":null,"abstract":"In this paper, we explore the optimization of \"saddle\" type finger layout for lateral SiC RESURF (Reduced Surface Electric Field) diodes where concave/convex finger ends combined with mesa etch isolation achieve over 82% of the inner cell breakdown voltage. Furthermore, added deep P+ JBS pattern near the anode Schottky contact significantly improves robustness against field crowding when cell pitch/finger width is reduced to densify the chip. Improved surge current capability compared with pure Schottky structure is investigated through mix-mode TCAD simulation. The proposed design methodologies offer guidance for future efforts toward realizing a monolithic SiC high voltage integrated circuit.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116405183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Morten Rahr Nielsen, Mathias Kirkeby, Hongbo Zhao, D. Dalal, Michael Møller Bech, S. Munk‐Nielsen
{"title":"Noise Analysis of Current Sensor for Medium Voltage Power Converter Enabled by Silicon-Carbide MOSFETs","authors":"Morten Rahr Nielsen, Mathias Kirkeby, Hongbo Zhao, D. Dalal, Michael Møller Bech, S. Munk‐Nielsen","doi":"10.1109/WiPDA56483.2022.9955291","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955291","url":null,"abstract":"New semiconductor devices based on wide bandgap materials are emerging in medium voltage power electronic converter applications, presenting new opportunities to the industry relying on semiconductor devices. SiC MOSFETs with blocking voltages of 10 kV (and above) is a promising technology, however, their fast switching transitions result in increased output voltage slew rate (dv/dt), which poses challenges to the applicability of the SiC MOSFET technology. This paper examines the impact of the increased dv/dt on the applicability of an off-the-shelf closed loop hall-effect current sensor when utilized in a medium voltage SiC MOSFET based power electronics converter. Analysis of the capacitive couplings in the current sensor is presented along with an experimental determination of the parasitic capacitance between its primary conductor and secondary winding. Experimental measurements have identified two distinct noise components in the current sensor measurement path due to: 1) capacitive coupling between the primary conductor and secondary winding, and 2) an inferred capacitive coupling into the active circuitry of the current sensor.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126130084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"3kV 6.7mΩ·cm2 4H-SiC BJT with An Effective Junction Termination Extension (JTE)","authors":"Xixi Luo, A. Q. Huang","doi":"10.1109/WiPDA56483.2022.9955277","DOIUrl":"https://doi.org/10.1109/WiPDA56483.2022.9955277","url":null,"abstract":"In this paper, an implantation-free 3 kV 4H-SiC Bipolar Junction Transistor (BJT) is designed, fabricated, and characterized. With a 40μm-wide Four-step Junction Termination Extension (JTE), an open base breakdown voltage (BVCEO) and an open emitter breakdown voltage (BVCBO) of more than 3000V are measured. The total width of the JTE is less than two times of the drift thickness (23μm), which can be considered as highly area efficient. The designed BJT has a 1.2μm narrow base width with 1×1017cm-3 doping, where implantation-free Ohmic contact was achieved. The BJT exhibits an excellent on-resistance of 6.7mΩ·cm2 for small size device and an on-resistance of 39.7mΩ·cm2 for large size device. The measured current gain for devices with additional anneal process is 21.","PeriodicalId":410411,"journal":{"name":"2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129069209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}