Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)最新文献

{"title":"Thin liquid flow-through core with machined flow channels","authors":"D. W. Hersey","doi":"10.1109/STHERM.2004.1291326","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291326","url":null,"abstract":"Liquid Flow-Through (LFT) cooling, where coolant passes directly through the core of line replaceable modules, is a key technology for enabling high-density, low-cost avionics for military applications. A key component for implementing reliable LFT cooling is the module core itself. This paper describes the development of a very thin core with machined flow channels. It summarizes the benefits of the core's design including improved producibility, enhanced thermal performance, simplified thermal analysis and ultimately reduced system operating costs. This paper describes trade-offs conducted to develop the core's design. Thermal performance was optimized while meeting pressure drop and operating pressure requirements.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132516744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 3-D stacked package solution for DDR-SDRAM applications","authors":"S. Krishnan, Young-Gon Kim, K. Bang","doi":"10.1109/STHERM.2004.1291303","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291303","url":null,"abstract":"To meet the electronic industry's growing demand for higher memory densities, the packaging industry has come up with solutions that allow multiple devices to be packaged within the same package footprint. These solutions are based on either die stacking or package stacking. This work discusses one such package stacking solution, called /spl mu/Z/spl trade/-Ball Stack package. While the focus of this paper is on the thermal performance characterization of the package, certain valuable insights on the design and electrical performance are also presented.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122105766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Research on a micro-channel heat exchanging system based on thermoelectric control","authors":"J. Jia, W. Wang, H.X. Wang, K. Fan","doi":"10.1109/STHERM.2004.1291328","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291328","url":null,"abstract":"A micro-channel heat exchanging system is developed for the thermal management of high-density electronic packages in the atrocious high-low temperature environment. Being a closed-loop system, it mainly consists of two micro-channel heat exchangers, a micro-pump, a few pipes, a thermoelectric module, some temperature sensors and an active controller. On the basis of the classical heat transfer theory and its correlations, a nonlinear analytical model is established for the system and a numerical simulation is preceded for a set of experimental equipment. Active control, based on the best performance coefficient of TEM, is utilized for the system. Some experiments are carried out with a set of experimental equipment in high-low temperature circumstances. The simulation results are well in accordance with the test results, on condition that the chip works at 18 to 50 with surrounding temperature ranged from -40 to 50. The research shows that the theoretical model correctly reflects the physical properties of the experimental equipment, and the model can be used to design thermal control systems for electronic chips in ugly temperature surroundings.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122139087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Developments in selective high thermal conductivity orientation in CTE-compatible substrate and package component materials","authors":"D. Saums","doi":"10.1109/STHERM.2004.1291299","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291299","url":null,"abstract":"Market requirements for through-plane thermal conductivity improvements capable of adequately dissipating heat loads from high heat flux semiconductor devices also require that such materials provide coefficient of thermal expansion compatibility to certain package material sets. Higher through-plane conductivity combined with CTE compatibility must be obtained in materials that are cost-effective and capable of displacing existing copper alloys, copper laminates, Kovar, and similar package materials. Applications by market include commercial, military, and industrial electronics and semiconductor modules. Such materials must also meet requirements for stiffness and strength, to prevent distortion under typical clamping forces applied, and have low density relative to copper. Novel uses of carbon fibers and the latest experimental data are introduced, illustrating the use of such carbon fibers inserted into a proven, rigid structural metal matrix composite material that has known practical attributes: CTE compatibility, isotropic thermal conductivity, low density, and high stiffness and strength. The baseline material is manufactured in a cost-effective, net shape process. Comparative data including cost projections for several materials offering both CTE compatibility and various levels of thermal conductivity, isotropic and anisotropic, are given.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114288272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Characterization of airflow impedance in two types of telecommunications chassis","authors":"J. Rhee, G. Wong","doi":"10.1109/STHERM.2004.1291319","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291319","url":null,"abstract":"The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123774917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal characterization of a mercury arc lamp for a projection display system","authors":"B. Bush, Shu Li, D. Kelley","doi":"10.1109/STHERM.2004.1291331","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291331","url":null,"abstract":"Avionics displays that operate in high temperature, low-pressure environments are challenging to design. Since the trend has been to reduce the physical dimensions of the electronics while increasing the effective display area with higher luminance and optical performance, the thermal design of this type of display product is a critical step in the design process. At the heart of one such display product is a high-pressure mercury arc lamp module, comprising of an arc tube and reflector housing. It dissipates roughly 1/3 to 1/2 of the total power in a display enclosure. The methods used to cool a high power light source could have a dramatic effect on the performance and the reliability of the other electrical components within the display enclosure. This paper will discuss the thermal design of the light source, a custom-designed high-pressure mercury arc lamp module for a projection display used in an avionics application. Computational Fluid Dynamics (CFD) was used to characterize the heat transfer path from the plasma arc to the lamp's outer housing and rest of the electronics within the enclosure. A few of the higher end CFD companies have developed plasma capabilities within their codes. These codes typically do not have the functionality to solve electronics box type problems efficiently. On the other hand, the \"electronics specific\" CFD codes do not have the higher end computational capabilities or the ability to mesh complex geometry. Because of this, both a general purpose and an electronics specific CFD code were used to accurately predict the temperatures in a projection enclosure used for an avionics display. To establish the complete model, a series of optical measurements was conducted on a typical arc tube and real lamp to obtain the critical parameters that are too complicated or impossible to generate by modeling alone. These parameters include the total radiant power of the lamp, radiant power distribution in different wavelength range, and the optical properties of the optical surfaces. Also measured was the temperature distribution of the lamp at predetermined points in well-controlled conditions. This optical and thermal data are used in the modeling process so the model can produce consistent and convergent results.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127503493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period","authors":"H. Bhowmik, K. W. Tou, C. Tso","doi":"10.1109/STHERM.2004.1291314","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291314","url":null,"abstract":"Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm/sup 2/ to 0.6 W/cm/sup 2/. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116347777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Integrated thin film heater and sensor with planar lightwave circuits","authors":"M. Yan, J. Weaver, C. Ho, X. Hao, T. Tarter","doi":"10.1109/STHERM.2004.1291322","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291322","url":null,"abstract":"This paper describes the use of integrated heaters and closed-loop applications for temperature control of planar waveguide circuits. The history of AWG temperature control is discussed along with the difficulties in applying this control. Modeling and measurement results for external and integrated heaters will be presented. Fundamental considerations as well as modeling and measurement of the thermal characteristics of various physical constructions are discussed, and the rationale for applying these disciplines to a given problem is highlighted. In this work, we will present the evolution of these unique integrated thin film heaters and review thermal-optical modeling to experimental demonstration of arrayed waveguide gratings (AWG). The goal of the work is to provide a solution path for integration of multiple optical devices on a single substrate from a thereto-mechanical as well as optical discipline point of view.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"434 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123422621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High performance active temperature control of a device under test (DUT)","authors":"J. Tustaniwskyj, J. W. Babcock","doi":"10.1109/STHERM.2004.1291305","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291305","url":null,"abstract":"Semiconductor devices typically are tested a number of times during the manufacturing process. Temperature control of the devices under test (DUTs) is critical since the manufacturer needs to ensure the functionality and switching speed of a device over a specified temperature range. An additional challenge is posed in the burn-in portion of semiconductor test, where voltage acceleration dramatically increases device power dissipation. In this paper we describe an active thermal control system which is capable of controlling DUTs with very high power dissipation and has a fast dynamic response. Also described in this paper are a technique to control DUTs that do not have a temperature sensor and a method to determine the quality of the thermal interface between the test head and the DUT.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117114908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal characterization of stacked-die packages","authors":"L. Zhang, N. Howard, V. Gumaste, A. Poddar, L. Nguyen","doi":"10.1109/STHERM.2004.1291302","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291302","url":null,"abstract":"Thermal characterization for multi-chip packages is a complicated process. Unlike the single-chip package, for which thermal resistance like /spl Theta//sub JA/ can be easily defined and measured, the presence of multiple heat sources in multi-chip packages makes the definition of thermal resistance impossible. In addition, multiple chip temperature typically needs to be measured at various power level combinations. In this paper, we studied a simple way to derive those chip temperatures by using the thermal resistance data from the equivalent single-chip packages. Our study is based on a comprehensive thermal evaluation of multi-chip packages. These packages contain 2 thermal test dice in a stacked fashion. Test samples were exclusively built based on 4 popular packaging types. Junction temperatures and board temperatures under standard JEDEC environment were measured using the Electrical Method and were correlated with the finite element-based detailed models. Based on an idealization of the heat transfer process, we derived a set of simple equations for approximating the junction and the board temperatures of stacked die packages. The only major input these equations require is the thermal resistance values of the equivalent single-chip packages, which are in general available. Therefore, no additional tests or simulations will be needed. In terms of accuracy, the new equations yielded promising results in most test cases although performance degradation does appear at certain package and boundary condition combinations.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129457557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}