Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)最新文献_第5页

Interconnect thermal management of high power packaged electronic architectures 高功率封装电子架构互连热管理

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291298

J. Cook, Y. Joshi, R. Doraiswami

{"title":"Interconnect thermal management of high power packaged electronic architectures","authors":"J. Cook, Y. Joshi, R. Doraiswami","doi":"10.1109/STHERM.2004.1291298","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291298","url":null,"abstract":"The trend in both the computing and electronic industries is to reduce the size of the electronic components while increasing both their performance and capability. Innovative thermal management schemes are needed in order to reduce the impact of the thermal loads. Most of the current electronic components are packaged in a plastic or ceramic container to provide chip and electrical lead protection. Both of these packaging materials have low thermal conductivity, making heat removal from the chip difficult. Thus, heat transfer through the off-chip metal interconnects offers an additional heat removal path. Ball grid array (BGA) interconnects provide an efficient means to connecting packaged high performance chips to printed circuit boards (PCB). As area array bump density increases, reducing Joule heating and electromigration will play an important role in chip and interconnect reliability. Among the many types of interconnects, solder balls offer an efficient means of connecting a chip or package to a PCB. Direct cooling of the solder balls is a new approach to removing heat from packaged chips. Jet impingement presents a unique solution for cooling the solder balls. Thermal and computational fluid dynamic (CFD) modeling of a plastic ball grid array (PBGA) package has demonstrated a significant decrease in temperature across the chip, package, and solder balls, when using jet impingement cooling.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121718307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Integration of thermal compact models into finite element simulation of printed wiring assemblies 将热压缩模型集成到印刷布线组件的有限元模拟中

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291334

D. Haller, K. Neumaier, S.H. Khan, K. Grattan

引用次数: 0

The creation of compact thermal models of electronic components using model reduction 使用模型缩减创建电子元件的紧凑热模型

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291309

X. Guo, D. Celo, P. Gunupudi, R. Khazaka, D. Walkey, T. Smy, M. Nakhla

{"title":"The creation of compact thermal models of electronic components using model reduction","authors":"X. Guo, D. Celo, P. Gunupudi, R. Khazaka, D. Walkey, T. Smy, M. Nakhla","doi":"10.1109/STHERM.2004.1291309","DOIUrl":"https://doi.org/10.1109/STHERM.2004.1291309","url":null,"abstract":"This paper presents a new approach to create boundary condition independent thermal compact models based on the multidimensional model reduction (MDMR) technique. A methodology is developed for the generation of a multi dimensional compact model (MDCM) from a detailed numerical model. The MDCM is shown to have a number of advantages over resistor network models. The generation of the model is at least an order of magnitude faster then the creation of an optimized network model. The MDCM displays very high accuracy typically better than 0.1%, is very flexible allowing for the prediction of all internal temperatures, and presents no limitations on the external configuration of the compact model. A generic multi-chip module ball grid array (MCMBGA) package is used to demonstrate the technique. The MDCM created shows to have high predictive capability, boundary condition independence and a small model size. Finally, by connecting the MDCM to a printed circuit board model and simulating the system, speed ups of around 100 times are achieved.","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130933563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Thermal management of a medical device using thermoelectric coolers 使用热电冷却器的医疗设备的热管理

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291312

Kuang-yu Wang

引用次数: 2

Thermal effects in monolithically integrated tunable laser transmitters 单片集成可调谐激光发射机的热效应

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/TCAPT.2005.859736

P. Kozodoy, T. Strand, Y. Akulova, G. Fish, C. Schow, P. Koh, Z. Bian, J. Christofferson, A. Shakouri

引用次数: 21

Nanoscale devices for solid state refrigeration and power generation 用于固态制冷和发电的纳米级器件

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291293

A. Shakouri

引用次数: 11

Thermal interaction of an array of flip chip components 倒装晶片元件阵列的热相互作用

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI: 10.1109/STHERM.2004.1291336

B. Joiner, T. Montes de Oca

引用次数: 0