倒装晶片元件阵列的热相互作用

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291336

B. Joiner, T. Montes de Oca

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引用次数: 0

摘要

通过模拟和测量，研究了一系列FC-CBGA元件的热相互作用。组件的有效热阻可以很容易地根据周围组件的密度翻倍。热阻的增加明显大于最近其他使用含铅元件的研究报告。

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Thermal interaction of an array of flip chip components

Thermal interactions for an array of FC-CBGA components were examined with both simulation and measurement. The effective thermal resistance of the component can easily double depending on the density of the surrounding components. The increase in thermal resistance is significantly greater than has been reported by other recent studies using leaded components.

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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