模拟电子芯片上电瞬态期自然对流换热的水冷却研究

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291314

H. Bhowmik, K. W. Tou, C. Tso

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引用次数: 4

摘要

采用水为实验对象，研究了4个模拟嵌入式电子芯片在通电瞬态期间的自然对流换热。热流密度范围为0.1 W/cm/sup 2/ ~ 0.6 W/cm/sup 2/。研究了热通量、芯片数量等几何参数的影响。相关性提出了个别芯片以及总体数据在瞬态状态。

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Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period

Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm/sup 2/ to 0.6 W/cm/sup 2/. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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