Characterization of airflow impedance in two types of telecommunications chassis

J. Rhee, G. Wong
{"title":"Characterization of airflow impedance in two types of telecommunications chassis","authors":"J. Rhee, G. Wong","doi":"10.1109/STHERM.2004.1291319","DOIUrl":null,"url":null,"abstract":"The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).","PeriodicalId":409730,"journal":{"name":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2004.1291319","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).
两种通信机箱气流阻抗特性分析
在非量纲坐标下测量和检查了用于电信机箱的两种常见配置的气流阻抗曲线,以便在海平面上获得的数据可以按比例缩放到更高的高度。结果表明,在所研究的大多数雷诺数范围内,两种底盘配置的无因次气流阻抗曲线预测风速随高度增加的变化最小。然而,对于一种底盘配置的研究,空气速度略有下降,预计随着高度的增加。因为如果假设恒定的空气速度,将导致在高空的非保守元件温度预测,如果有关键的电子元件在其最高温度附近工作,则应考虑到空气速度的下降。在4000米(13000英尺)高度的电信设备中,电子元件的可靠运行是网络设备和建筑标准(NEBS)的要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信