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Proceedings of Electro/International 1995最新文献

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An overview of the VSPA semiconductor package VSPA半导体封装概述
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471033
M. Portuondo
{"title":"An overview of the VSPA semiconductor package","authors":"M. Portuondo","doi":"10.1109/ELECTR.1995.471033","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471033","url":null,"abstract":"The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115170094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Environmentally appropriate materials and processes 适合环境的材料和工艺
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471044
E. Harriman
{"title":"Environmentally appropriate materials and processes","authors":"E. Harriman","doi":"10.1109/ELECTR.1995.471044","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471044","url":null,"abstract":"In order to be competitive in today's global marketplace, US manufacturing companies must adopt new strategies for meeting international standards and achieving environmental protection goals. Companies increasingly discover that it is possible to be both environmentally responsible and competitive. The solution is found in proactive and preventative strategies. Rather than the traditional method of dealing with the environmental and regulatory consequences of materials and process choices, a proactive company will incorporate environmental considerations into all of their decision making processes. This includes: materials choices during research and product design, manufacturing process development, process modifications and improvements, and operations practices. To help companies meet their environmental obligations while maintaining competitiveness, this paper covers proactive and preventive strategies which can be applied in the design and manufacture of products and process. It also provides direction to industries/companies seeking environmentally preferable materials, processes and strategies.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"152 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126016820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Using multimedia and virtual reality in engineering and manufacturing 在工程和制造中使用多媒体和虚拟现实
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471035
C. Machover
{"title":"Using multimedia and virtual reality in engineering and manufacturing","authors":"C. Machover","doi":"10.1109/ELECTR.1995.471035","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471035","url":null,"abstract":"New visual technologies like virtual reality and multimedia that expand the computer graphics \"tool kit\" have been often associated with \"fringe\" applications in art and entertainment. However, there are a growing number of actual and potential applications in engineering and manufacturing such as: automotive design, industrial design, mechanical design, architecture, computational fluid dynamics, human factors analysis, telepresence (remote manipulation), training/simulation, documentation, and marketing. For example, forecasters estimate that VR and multimedia applications in engineering and manufacturing will account for about 1/3 of the $11.1 billion revenues developed in 1994. This paper will update you on what's happening with the new visual technologies, help you understand what virtual reality and multimedia are, how they are related, review for what applications virtual reality and multimedia are now being used in engineering and manufacturing, separate what's real from what's hype, discuss what products and services are available and from whom, discuss the markets sizes, review what are the impediments to growth, and discuss what we can expect in the near future.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130395866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Multiplexing in test mode reduces pin count requirements 测试模式下的多路复用减少了引脚数需求
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471026
O. Yishay
{"title":"Multiplexing in test mode reduces pin count requirements","authors":"O. Yishay","doi":"10.1109/ELECTR.1995.471026","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471026","url":null,"abstract":"A new integration module in the Motorola Modular Family of Microcontrollers implements a multiplexed test mode which allows internal signals to be driven even when the input pin used to drive that signal is not implemented. This test mode allows the minimum pin set that was defined for this new integration module to provide the same controllability and observability as the full pin set. This produced a significant cost savings, since it maintains the fault coverage of a large number of test patterns that were developed using previous maximum pin set integration modules.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123169391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reliability of electronic devices containing epoxy resins 含环氧树脂的电子设备的可靠性
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471023
J. C. Spitsbergen
{"title":"Reliability of electronic devices containing epoxy resins","authors":"J. C. Spitsbergen","doi":"10.1109/ELECTR.1995.471023","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471023","url":null,"abstract":"Epoxy resins, because of their favorable balance of properties including high adhesion and strength, and resistance to heat, chemicals and moisture, along with low shrinkage and dielectric constant, have been widely used in the packaging of electronic circuits containing silicon die, typically IC's, to achieve high reliability. Thus, conductive adhesives have generally replaced solder for die attach. When the more compact flip chip is used, the thermal cycling failure time can be extended by epoxy resin encapsulation. Further, although die coatings have been applied using many types of polymers, which may excel an epoxy resin based coating in any one property, epoxy resin based coatings should provide higher reliability due to their better property balance. In addition, except for extreme conditions (such as very high temperatures), lower cost post-molded epoxy resin based encapsulations are as reliable as hermetic packages. This it shown by many studies of field results as well as by predictions using environmental stress testing. Even lower cost as well as decreased size, while maintaining the reliability comparable to hermetic devices, appear possible through an epoxy resin based upgraded glob top process. It is shown that epoxy resin glob top encapsulations can be formulated to easily exceed 1000 hs. in 85/spl deg/C/85% RH testing. Studies demonstrating the reliability of epoxy resin based surface mount placement and lead bonding adhesives are discussed. Thus lower cost, yet highly reliable, electronic devices can be manufactured through the use of formulations based on epoxy resins.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123309573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Global intelligent networking: architectures, services and design principles 全球智能网络:架构、服务和设计原则
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471027
S. Yeh
{"title":"Global intelligent networking: architectures, services and design principles","authors":"S. Yeh","doi":"10.1109/ELECTR.1995.471027","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471027","url":null,"abstract":"This article focuses on the driving needs, key attributes, design principles, design target and constraints of an intelligent global infrastructure as global carriers all move rapidly toward seamless services deployment. First, this article reviews the needs for and the driving forces behind a global intelligent infrastructure. Second, the attributes or key characteristics of a global information superhighway, along with its potential applications, are postulated. The AT&T Worldwide Intelligent Network is illustrated as an application example. Finally, the guiding principles, design targets and design constraints frequently utilized by network architects and system designers are presented. Some presentation materials or viewgraphs are illustrated.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"42 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120994520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
RF power amplifiers-classes A through S 射频功率放大器- A到S类
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471024
N. Sokal
{"title":"RF power amplifiers-classes A through S","authors":"N. Sokal","doi":"10.1109/ELECTR.1995.471024","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471024","url":null,"abstract":"With at least ten lettered classes of RF power amplifiers and several combinations of those classes, it is not surprising that many RF engineers are confused about power amplifiers. The complexity of the subject is compounded by the fact that the RF power transistor acts as a high-resistance current source or as a low-resistance switch, or - in some amplifiers - as a high-resistance current source during part of the\" on\" interval and as a low-resistance switch during another part of the\" on\" interval (mixed-mode operation). Inspection of the circuit topology is not sufficient to define unambiguously the transistor operating mode or the amplifier class of operation. In this paper the authors present the facts to clarify matters.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122796716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Designing-in plastics, polymers, and novel materials in your electronics products 在您的电子产品中设计塑料，聚合物和新型材料
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471031
N. Schott
{"title":"Designing-in plastics, polymers, and novel materials in your electronics products","authors":"N. Schott","doi":"10.1109/ELECTR.1995.471031","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471031","url":null,"abstract":"The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125883310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Engineer your marketing plan for sales success 为销售成功设计你的营销计划
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471048
J. Geisman
{"title":"Engineer your marketing plan for sales success","authors":"J. Geisman","doi":"10.1109/ELECTR.1995.471048","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471048","url":null,"abstract":"In this discussion on marketing plan engineering the following points are considered: sales success is a numbers game; match what you are selling to what customers are buying; product lifecycles and buyer behavior models are useful; build sales momentum with sales and marketing leverage; and marketing plan implementation issues.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122252853","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
How to select an ISO 9000 registrar 如何选择iso9000注册商
Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471037
M. Langer
{"title":"How to select an ISO 9000 registrar","authors":"M. Langer","doi":"10.1109/ELECTR.1995.471037","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471037","url":null,"abstract":"For companies striving to meet the ISO 9000 standards, one of the critical choices a company has to make is selecting a registrar. The numerous registrars, standards and governmental requirements that need to be evaluated when choosing a registrar can make this a difficult task. To help you evaluate a registrar this paper provides general information on the registration process and answers the following questions: What is a registrar? What is accreditation? Is accreditation important? What is a notified body? What to look for in selecting a registrar? What is the registration process? What are the costs? How long does registration process take?.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114966591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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