Reliability of electronic devices containing epoxy resins

J. C. Spitsbergen
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引用次数: 2

Abstract

Epoxy resins, because of their favorable balance of properties including high adhesion and strength, and resistance to heat, chemicals and moisture, along with low shrinkage and dielectric constant, have been widely used in the packaging of electronic circuits containing silicon die, typically IC's, to achieve high reliability. Thus, conductive adhesives have generally replaced solder for die attach. When the more compact flip chip is used, the thermal cycling failure time can be extended by epoxy resin encapsulation. Further, although die coatings have been applied using many types of polymers, which may excel an epoxy resin based coating in any one property, epoxy resin based coatings should provide higher reliability due to their better property balance. In addition, except for extreme conditions (such as very high temperatures), lower cost post-molded epoxy resin based encapsulations are as reliable as hermetic packages. This it shown by many studies of field results as well as by predictions using environmental stress testing. Even lower cost as well as decreased size, while maintaining the reliability comparable to hermetic devices, appear possible through an epoxy resin based upgraded glob top process. It is shown that epoxy resin glob top encapsulations can be formulated to easily exceed 1000 hs. in 85/spl deg/C/85% RH testing. Studies demonstrating the reliability of epoxy resin based surface mount placement and lead bonding adhesives are discussed. Thus lower cost, yet highly reliable, electronic devices can be manufactured through the use of formulations based on epoxy resins.<>
含环氧树脂的电子设备的可靠性
环氧树脂,由于其良好的性能平衡,包括高附着力和强度,耐热,耐化学品和防潮,以及低收缩率和介电常数,已广泛应用于包含硅芯片的电子电路的封装,通常是集成电路,以实现高可靠性。因此,导电胶粘剂已普遍取代焊料用于模具连接。当使用更紧凑的倒装芯片时,通过环氧树脂封装可以延长热循环失效时间。此外,尽管模具涂层已经使用了许多类型的聚合物,这些聚合物可能在任何一种性能上都优于环氧树脂基涂层,但环氧树脂基涂层应该提供更高的可靠性,因为它们具有更好的性能平衡。此外,除了极端条件(如非常高的温度)外,成本较低的后成型环氧树脂基封装与密封封装一样可靠。许多实地研究结果以及使用环境压力测试的预测都表明了这一点。更低的成本和更小的尺寸,同时保持与密封装置相当的可靠性,通过基于环氧树脂的升级球形顶工艺成为可能。结果表明,环氧树脂球形包封剂的配制时间很容易超过1000小时。85/spl度/C/85% RH测试。讨论了环氧树脂基表面贴装和铅接粘合剂的可靠性研究。因此,通过使用基于环氧树脂的配方,可以制造成本更低但可靠性更高的电子设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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