在您的电子产品中设计塑料,聚合物和新型材料

N. Schott
{"title":"在您的电子产品中设计塑料,聚合物和新型材料","authors":"N. Schott","doi":"10.1109/ELECTR.1995.471031","DOIUrl":null,"url":null,"abstract":"The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Designing-in plastics, polymers, and novel materials in your electronics products\",\"authors\":\"N. Schott\",\"doi\":\"10.1109/ELECTR.1995.471031\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation.<<ETX>>\",\"PeriodicalId\":397146,\"journal\":{\"name\":\"Proceedings of Electro/International 1995\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Electro/International 1995\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTR.1995.471031\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Electro/International 1995","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTR.1995.471031","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

作者简要介绍了塑料在电子封装中的应用。他研究了集成电路器件的材料加工、性能和封装,并简要讨论了塑料创新研究所的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Designing-in plastics, polymers, and novel materials in your electronics products
The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信