{"title":"VSPA半导体封装概述","authors":"M. Portuondo","doi":"10.1109/ELECTR.1995.471033","DOIUrl":null,"url":null,"abstract":"The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An overview of the VSPA semiconductor package\",\"authors\":\"M. Portuondo\",\"doi\":\"10.1109/ELECTR.1995.471033\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics.<<ETX>>\",\"PeriodicalId\":397146,\"journal\":{\"name\":\"Proceedings of Electro/International 1995\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Electro/International 1995\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTR.1995.471033\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Electro/International 1995","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTR.1995.471033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics.<>
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