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2016 IEEE Hot Chips 28 Symposium (HCS)最新文献

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The era of high bandwidth memory 高带宽存储器时代
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936171
K. Tran
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引用次数: 6
Mobile 3D capture for professional applications 移动3D捕获专业应用程序
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936199
R. Spring
{"title":"Mobile 3D capture for professional applications","authors":"R. Spring","doi":"10.1109/HOTCHIPS.2016.7936199","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936199","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127903368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quantum dot based imagers for multispectral cameras and sensors 用于多光谱相机和传感器的量子点成像仪
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936215
E. Mandelli
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引用次数: 1
Modularizing the microprocessor core to outperform traditional out-of-order 模块化的微处理器核心，以超越传统的无序
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936230
Tony Nowatzki, K. Sankaralingam
{"title":"Modularizing the microprocessor core to outperform traditional out-of-order","authors":"Tony Nowatzki, K. Sankaralingam","doi":"10.1109/HOTCHIPS.2016.7936230","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936230","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121466300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Piton: A 25-core academic manycore research processor Piton:一个25核学术多核研究处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936217
Michael McKeown, Yaosheng Fu, Tri M. Nguyen, Yanqi Zhou, Jonathan Balkind, Alexey Lavrov, Mohammad Shahrad, Samuel Payne, D. Wentzlaff
{"title":"Piton: A 25-core academic manycore research processor","authors":"Michael McKeown, Yaosheng Fu, Tri M. Nguyen, Yanqi Zhou, Jonathan Balkind, Alexey Lavrov, Mohammad Shahrad, Samuel Payne, D. Wentzlaff","doi":"10.1109/HOTCHIPS.2016.7936217","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936217","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"264 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120959624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
SDA: Software-Defined Accelerator for general-purpose big data analysis system SDA:通用大数据分析系统的软件定义加速器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936221
Jian Ouyang, Wei Qi, Yong Wang, YichenTu, Jing Wang, Bowen Jia
{"title":"SDA: Software-Defined Accelerator for general-purpose big data analysis system","authors":"Jian Ouyang, Wei Qi, Yong Wang, YichenTu, Jing Wang, Bowen Jia","doi":"10.1109/HOTCHIPS.2016.7936221","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936221","url":null,"abstract":"•Present general-purpose big data accelerator -Design for general-purpose big data analysis system, such as SparkSQL, HIVE -Abstract SQL operations -Propose the SDA hardware and software architecture -Implement SDA hardware by FPGA •SDA is also designed for distributed system -Data flow program model -Resource on-demand •Demonstrate the feasibility of SDA for big data and AI -SDA for AI on Hotchips2014","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126831632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Encoder logic for reducing serial I/O power in sensors and sensor hubs 用于减少传感器和传感器集线器中串行I/O功率的编码器逻辑
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936231
Phillip Stanley-Marbell, P. Francese, M. Rinard
{"title":"Encoder logic for reducing serial I/O power in sensors and sensor hubs","authors":"Phillip Stanley-Marbell, P. Francese, M. Rinard","doi":"10.1109/HOTCHIPS.2016.7936231","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936231","url":null,"abstract":"Communicating data from sensors such as gyroscopes and accelerometers, to processors, typically occurs over printed circuit board traces. This communication can cost up to 40 µW at data rates of 1 Mb/s.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133484590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Inside 6th gen Intel® Core™: New microarchitecture code named skylake 内置第六代英特尔®酷睿™:名为skylake的新微架构代码
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936222
Ittai Anati, D. Blythe, Jack Doweck, Hong Jiang, W. Kao, Julius Mandelblat, Lihu Rappoport, Efraim Rotem, Ahmad Yasin
{"title":"Inside 6th gen Intel® Core™: New microarchitecture code named skylake","authors":"Ittai Anati, D. Blythe, Jack Doweck, Hong Jiang, W. Kao, Julius Mandelblat, Lihu Rappoport, Efraim Rotem, Ahmad Yasin","doi":"10.1109/HOTCHIPS.2016.7936222","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936222","url":null,"abstract":"•Skylake delivers record levels of performance and battery life in many personal computing use cases and form factors •Intel® Speed Shift Technology provides higher performance, responsiveness and efficiency at power constrained form factors •Skylake Processor Graphics delivers scalable performance, >1TFLOPS compute, enhanced low power media engines, flexible power management, and end-to-end 4K experience •Skylake family of products allows developers to: •Choose from wide range of platform capabilities •Innovate with products for wide range of thermal envelopes and I/O solutions •Optimize the system performance using the advanced PMU capabilities •Skylake introduces Intel® SGX: a revolutionary game changer to trusted application security in the main stream SW environment","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133989956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Task parallel programming model + hardware acceleration = performance advantage 任务并行编程模型+硬件加速=性能优势
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936235
Tamer Dallou, D. C. S. Lucas, G. Araújo, Lucas Morais, Eduardo Ferreira Barbosa, Michael Frank, Richard Bagley, Raj Sayana
{"title":"Task parallel programming model + hardware acceleration = performance advantage","authors":"Tamer Dallou, D. C. S. Lucas, G. Araújo, Lucas Morais, Eduardo Ferreira Barbosa, Michael Frank, Richard Bagley, Raj Sayana","doi":"10.1109/HOTCHIPS.2016.7936235","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936235","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128373267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Samsung exynos M1 processor 三星exynos M1处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936205
B. Burgess
{"title":"Samsung exynos M1 processor","authors":"B. Burgess","doi":"10.1109/HOTCHIPS.2016.7936205","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936205","url":null,"abstract":"• Samsung's first from scratch CPU design • Very aggressive, 3-year design schedule • Cleanly into Production on time • Performance and efficiency gains over prior generation • Best in class quad core mobile design • More to come…","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"375 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124691435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
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