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2016 IEEE Hot Chips 28 Symposium (HCS)最新文献

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MvEcho - acoustic response modelling for auralisation MvEcho -听觉化的声学响应模型
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936238
Léonie Buckley, Sam Caulfield, D. Moloney
{"title":"MvEcho - acoustic response modelling for auralisation","authors":"Léonie Buckley, Sam Caulfield, D. Moloney","doi":"10.1109/HOTCHIPS.2016.7936238","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936238","url":null,"abstract":"•Auralisation is the process of simulating the listening experience at a given position. •While many auralisation algorithms currently exist, the majority require a manual description of the environment. •In contrast, MvEcho removes the need for this manual description to provide an environment independent algorithm to approximate auralisation. •Initial implementation of MvEcho concerned the acoustic response of objects, namely the pyramid El Castillo, (shown below in Fig. 1) and has now been extended to model the response of rooms. •The algorithm is fully functional in C and is currently being ported to the Myriad 2.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127330388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Experiences using a novel Python-based hardware modeling framework for computer architecture test chips 在计算机架构测试芯片中使用新颖的基于python的硬件建模框架的经验
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936233
Christopher Torng, Moyang Wang, Bharath Sudheendra, Nagaraj Murali, Suren Jayasuriya, S. Srinath, T. Pritchard, Robin Ying, C. Batten
{"title":"Experiences using a novel Python-based hardware modeling framework for computer architecture test chips","authors":"Christopher Torng, Moyang Wang, Bharath Sudheendra, Nagaraj Murali, Suren Jayasuriya, S. Srinath, T. Pritchard, Robin Ying, C. Batten","doi":"10.1109/HOTCHIPS.2016.7936233","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936233","url":null,"abstract":"This poster will describe a taped-out 2×2mm 1.3 M-transistor test chip in IBM 130 nm designed using our new Python-based hardware modeling framework. The goal of our tapeout was to demonstrate the ability of this framework to enable Agile hardware design flows.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122099171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
QORIQ® LS1012A: Big things in small packages: 64-bit core in a sub-10mm package QORIQ®LS1012A:小封装中的大东西:64位内核在低于10mm的封装中
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936227
Ben Eckermann
{"title":"QORIQ® LS1012A: Big things in small packages: 64-bit core in a sub-10mm package","authors":"Ben Eckermann","doi":"10.1109/HOTCHIPS.2016.7936227","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936227","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133445908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inuitive breakthrough solution for AR and VR worlds 直观的AR和VR世界的突破性解决方案
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936197
Dor Zepeniuk
{"title":"Inuitive breakthrough solution for AR and VR worlds","authors":"Dor Zepeniuk","doi":"10.1109/HOTCHIPS.2016.7936197","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936197","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"178 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122315504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Pascal GPU with NVLink 帕斯卡的GPU是NVLink
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936202
John Danskin, D. Foley
{"title":"Pascal GPU with NVLink","authors":"John Danskin, D. Foley","doi":"10.1109/HOTCHIPS.2016.7936202","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936202","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116564993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Introducing “parker”: Next-generation tegra system-on-chip 介绍“帕克”:下一代tegra片上系统
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936207
Andi Skende
{"title":"Introducing “parker”: Next-generation tegra system-on-chip","authors":"Andi Skende","doi":"10.1109/HOTCHIPS.2016.7936207","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936207","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124069636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
3D sensors for the rest of us 给我们其余的人3D传感器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936194
Larry Yang
{"title":"3D sensors for the rest of us","authors":"Larry Yang","doi":"10.1109/HOTCHIPS.2016.7936194","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936194","url":null,"abstract":"This article consists only of a collection of slide images from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124588033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Embedded deep neural networks: “The cost of everything and the value of nothing” 嵌入式深度神经网络:“所有东西的成本和没有价值”
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936219
D. Moloney
{"title":"Embedded deep neural networks: “The cost of everything and the value of nothing”","authors":"D. Moloney","doi":"10.1109/HOTCHIPS.2016.7936219","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936219","url":null,"abstract":"•Deep Learning for Embedded is all about Inference •Standard Networks are designed to achieve high-accuracy •Embedded implementation on architectures such as Movidius VPU can achieve significant performance results at the network edge •Next challenge is to further optimise networks to maximise performance per Watt","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126528285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Software in Silicon in the Oracle SPARC M7 processor 软件在硅在Oracle的SPARC M7处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936220
K. Aingaran, Sumti Jairath, D. Lutz
{"title":"Software in Silicon in the Oracle SPARC M7 processor","authors":"K. Aingaran, Sumti Jairath, D. Lutz","doi":"10.1109/HOTCHIPS.2016.7936220","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936220","url":null,"abstract":"1 SW in Silicon is custom hardware targeted at specific higher level functions traditionally implemented in software 2 Cloud based applications, especially analytics, offer many opportunities for SW in Silicon features 3 SW in Silicon in SPARC M7 provides gains in Performance, Power, Security and Memory Capacity 4 Oracle database automatically uses these SW in Silicon features. Other applications access through public API 5 Oracle is researching tighter HW-SW codesign, targeting deeper gains on a wider set of applications","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123478302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
The bifrost GPU architecture and the ARM Mali-G71 GPU bifrost GPU架构和ARM Mali-G71 GPU
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936201
J. Davies
{"title":"The bifrost GPU architecture and the ARM Mali-G71 GPU","authors":"J. Davies","doi":"10.1109/HOTCHIPS.2016.7936201","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936201","url":null,"abstract":"■ Leverages Mali's scalable architecture ■ Scalable to 32 shader cores ■ Major shader core redesign ■ New scalar, clause-based ISA ■ New quad-based arithmetic units ■ New geometry data flow ■ Reduces memory bandwidth and footprint ■ Support for fine grain buffer sharing with the CPU","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124845549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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