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2016 IEEE Hot Chips 28 Symposium (HCS)最新文献

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POWER9: Processor for the cognitive era POWER9:认知时代的处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936223
Brian W. Thompto
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引用次数: 18
Memory as we approach a new horizon 回忆，当我们接近一个新的地平线
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936169
J. T. Pawlowski
{"title":"Memory as we approach a new horizon","authors":"J. T. Pawlowski","doi":"10.1109/HOTCHIPS.2016.7936169","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936169","url":null,"abstract":"■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth options with GDDR5X as highest BW/$ ■ HMC delivers unique advantages for ultra-high bandwidth applications ■ Emergence of Persistent Memory, first as DRAM+NAND NVDIMM - Evolving, enabling new and better products ■ 2016 production of first new memory technology in decades: 3D XPoint™ Memory ■ The future: blending the many existing and new memory types - Overall cost and performance tuned to the application","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125409922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
AnyCore-1: A comprehensively adaptive 4-way superscalar processor AnyCore-1:一个全面自适应的4路超标量处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936237
Rangeen Basu Roy Chowdhury, Anil K. Kannepalli, E. Rotenberg
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引用次数: 2
An intelligent ADAS processor with real-time semi-global matching and intention prediction for 720p stereo vision 一种面向720p立体视觉的半全局实时匹配和意图预测的智能ADAS处理器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936225
K. Lee, Kyeongryeol Bong, Changhyeon Kim, H. Yoo
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引用次数: 4
The path to embedded vision & AI using a low power vision DSP 使用低功耗视觉DSP实现嵌入式视觉和人工智能的路径
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936209
Yair Siegel
{"title":"The path to embedded vision & AI using a low power vision DSP","authors":"Yair Siegel","doi":"10.1109/HOTCHIPS.2016.7936209","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936209","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"vmr-5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127931379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
The future of graphic and mobile memory for new applications 未来的图形和移动存储器的新应用
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI: 10.1109/HOTCHIPS.2016.7936170
Jin Kim
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引用次数: 4
MvEcho MvEcho
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/HOTCHIPS.2016.7936239
Léonie Buckley, Sam Caulfield, David Moloney
{"title":"MvEcho","authors":"Léonie Buckley, Sam Caulfield, David Moloney","doi":"10.1109/HOTCHIPS.2016.7936239","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2016.7936239","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115630771","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A “zero displacement” active ultrasonic force sensor for mobile applications 用于移动应用的“零位移”主动超声波力传感器
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2016.7936214
{"title":"A “zero displacement” active ultrasonic force sensor for mobile applications","authors":"","doi":"10.1109/hotchips.2016.7936214","DOIUrl":"https://doi.org/10.1109/hotchips.2016.7936214","url":null,"abstract":"Active ultrasonic sensing allows for simultaneous touch/force sensing on a wide variety of surfaces • Can sense force without requiring surface deflection • Allows for new device industrial design, as well as user interaction on traditionally inactive surfaces","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134643496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Intel® omni-path 4.8 Tbps switch ASIC and platform Intel®全路径4.8 Tbps交换机ASIC和平台
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2016.7936213
{"title":"Intel® omni-path 4.8 Tbps switch ASIC and platform","authors":"","doi":"10.1109/hotchips.2016.7936213","DOIUrl":"https://doi.org/10.1109/hotchips.2016.7936213","url":null,"abstract":"","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129156195","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Experiences using a novel Python-based hardware modeling framework for computer architecture test chips 在计算机架构测试芯片中使用新颖的基于python的硬件建模框架的经验
2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2016.7936232
{"title":"Experiences using a novel Python-based hardware modeling framework for computer architecture test chips","authors":"","doi":"10.1109/hotchips.2016.7936232","DOIUrl":"https://doi.org/10.1109/hotchips.2016.7936232","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126194239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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