{"title":"回忆,当我们接近一个新的地平线","authors":"J. T. Pawlowski","doi":"10.1109/HOTCHIPS.2016.7936169","DOIUrl":null,"url":null,"abstract":"■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth options with GDDR5X as highest BW/$ ■ HMC delivers unique advantages for ultra-high bandwidth applications ■ Emergence of Persistent Memory, first as DRAM+NAND NVDIMM - Evolving, enabling new and better products ■ 2016 production of first new memory technology in decades: 3D XPoint™ Memory ■ The future: blending the many existing and new memory types - Overall cost and performance tuned to the application","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Memory as we approach a new horizon\",\"authors\":\"J. T. Pawlowski\",\"doi\":\"10.1109/HOTCHIPS.2016.7936169\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth options with GDDR5X as highest BW/$ ■ HMC delivers unique advantages for ultra-high bandwidth applications ■ Emergence of Persistent Memory, first as DRAM+NAND NVDIMM - Evolving, enabling new and better products ■ 2016 production of first new memory technology in decades: 3D XPoint™ Memory ■ The future: blending the many existing and new memory types - Overall cost and performance tuned to the application\",\"PeriodicalId\":363333,\"journal\":{\"name\":\"2016 IEEE Hot Chips 28 Symposium (HCS)\",\"volume\":\"68 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Hot Chips 28 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2016.7936169\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Hot Chips 28 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2016.7936169","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth options with GDDR5X as highest BW/$ ■ HMC delivers unique advantages for ultra-high bandwidth applications ■ Emergence of Persistent Memory, first as DRAM+NAND NVDIMM - Evolving, enabling new and better products ■ 2016 production of first new memory technology in decades: 3D XPoint™ Memory ■ The future: blending the many existing and new memory types - Overall cost and performance tuned to the application