{"title":"The era of high bandwidth memory","authors":"K. Tran","doi":"10.1109/HOTCHIPS.2016.7936171","DOIUrl":null,"url":null,"abstract":"■ HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor ■ HBM device provide various mechanisms to ensure quality/reliability at pre and post SiP assembly ■ HBM is an industry standard solution with multiple supply sources","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Hot Chips 28 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2016.7936171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
■ HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor ■ HBM device provide various mechanisms to ensure quality/reliability at pre and post SiP assembly ■ HBM is an industry standard solution with multiple supply sources