高带宽存储器时代

2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI:10.1109/HOTCHIPS.2016.7936171

K. Tran

{"title":"高带宽存储器时代","authors":"K. Tran","doi":"10.1109/HOTCHIPS.2016.7936171","DOIUrl":null,"url":null,"abstract":"■ HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor ■ HBM device provide various mechanisms to ensure quality/reliability at pre and post SiP assembly ■ HBM is an industry standard solution with multiple supply sources","PeriodicalId":363333,"journal":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"The era of high bandwidth memory\",\"authors\":\"K. Tran\",\"doi\":\"10.1109/HOTCHIPS.2016.7936171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"■ HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor ■ HBM device provide various mechanisms to ensure quality/reliability at pre and post SiP assembly ■ HBM is an industry standard solution with multiple supply sources\",\"PeriodicalId\":363333,\"journal\":{\"name\":\"2016 IEEE Hot Chips 28 Symposium (HCS)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Hot Chips 28 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2016.7936171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Hot Chips 28 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2016.7936171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

■HBM是一种突破性的内存解决方案，适用于性能、功耗和外形尺寸受限的系统，提供高带宽、低有效功耗和小外形尺寸■HBM器件提供各种机制，以确保SiP前后组装的质量/可靠性■HBM是一种具有多个电源来源的行业标准解决方案

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The era of high bandwidth memory

■ HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor ■ HBM device provide various mechanisms to ensure quality/reliability at pre and post SiP assembly ■ HBM is an industry standard solution with multiple supply sources

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE Hot Chips 28 Symposium (HCS)

自引率

0.00%

发文量