Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)最新文献_第5页

Surface mount conductive adhesives with superior impact resistance 表面贴装导电胶粘剂，具有优异的抗冲击性

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664467

S.A. Vons, Q. Tong, R. Kuder, D. Shenfield

{"title":"Surface mount conductive adhesives with superior impact resistance","authors":"S.A. Vons, Q. Tong, R. Kuder, D. Shenfield","doi":"10.1109/ISAPM.1998.664467","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664467","url":null,"abstract":"Surface mount conductive adhesives (SMCAs) provide an environmentally friendly solution for interconnections in electronic applications. In addition, SMCAs offer other attractive technical advantages over conventional metal solders including low temperature processing, fine pitch capability, and enhanced thermal cycling performance. However, one key obstacle to general replacement of metal solders by SMCAs in electronic applications is the poor impact resistance of the adhesive interconnections, which is characterized by the industry standardized \"drop test\" A structure-property-performance study of SMCAs was undertaken with the goal of identifying the key material properties for improved \"drop test\" performance. This study identified energy dissipation as the key factor governing \"drop test\" performance and, accordingly, reduced modulus and increased loss factor to be the material properties of importance. The above findings are based on analysis of a physical model of the SMCA assembly used for the \"drop test\", and further verified by experimental results on a series of exploratory SMCA materials. This study not only led to a thorough understanding of the key performance requirements of the material, but also yielded novel adhesive materials with superior impact resistance capable of maintaining adhesive interconnections during \"drop test\".","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"189 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122528378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 30

Some factors that affect performance of capillary flip chip underfills 影响毛细管倒装衬底性能的一些因素

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664428

M. Edwards

引用次数: 7

Thermal conductivity and specific heat determinations of a set of lead-free solder alloys 一套无铅焊料合金的热导率和比热测定

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664460

L. Kehoe, G. Crean

引用次数: 10

Review of RF packaging research at Georgia Tech's PRC 佐治亚理工学院PRC射频封装研究综述

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664451

J. Laskar, N. Jokerst, M. Brooke, M. Harris, C. Chun, A. Pham, H. Liang, D. Staiculescu, S. Sutono

{"title":"Review of RF packaging research at Georgia Tech's PRC","authors":"J. Laskar, N. Jokerst, M. Brooke, M. Harris, C. Chun, A. Pham, H. Liang, D. Staiculescu, S. Sutono","doi":"10.1109/ISAPM.1998.664451","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664451","url":null,"abstract":"Consistent with the Packaging Research Center's vision of low cost single level integrated modules (SLIM), the Wireless Thrust is focused on developing integrated solutions for wireless interfaces. The core focus is to develop: (1) Development and analysis of multilayer microwave assemblies. The goal is to assess the critical technology break points required for SLIM and requirements for SLIM to progress to higher frequencies of operation. This project includes development of SLIM based high frequency test structures for evaluation and study. (2) Development of RF microwave packaging and interconnects for microwave multichip assemblies. This project focuses on developing the necessary structural properties for SLIM to operate at MM wave frequencies with particular emphasis upon developing vertical interconnects. (3) Development of next generation wireless integration approaches. This project focuses upon applying thin-film integration to develop three dimensional wireless ICs for direct integration with SLIM. A detailed data base development is proposed, based upon PRC SLIM prototypes, to establish measurement based methodology to accurately model entire high density interconnect systems at microwave frequencies.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"203 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114739703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Pre-develop bake for end point stabilization with photo-BCB polymers 预显影烘烤终点稳定与光- bcb聚合物

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664439

D. Scheck, B. Rogers, P. Garrou, M. Dibbs, A. Strandjord, S. Cummings, Y. Ida

引用次数: 3

Thermal greases with exceptionally high thermal conductivity and low thermal resistance 具有高导热性和低热阻的热润滑脂

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664459

R. Hunadi, R. Wells

{"title":"Thermal greases with exceptionally high thermal conductivity and low thermal resistance","authors":"R. Hunadi, R. Wells","doi":"10.1109/ISAPM.1998.664459","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664459","url":null,"abstract":"The need for higher performance thermal interface materials has been spurred by the higher thermal demands of new microprocessors, MCMs and other high speed devices. These devices typically produce 10-40 watts of heat. Many applications require the use of a removable interface material along with the need to minimize the bond line and thermal resistance. In addition, greases can compensate for surface nonplanarity approaching 3-4 mils for heat sinks and device packages. In the past several years, a number of diamond filled greases, with claims of high thermal conductivity, have been reported but these products were not practical for low cost consumer applications such as severs, desktop and laptop computers. Other fillers such as boron nitride and aluminum nitride have also been used but most of the previous available fillers were optimized for use in producing ceramic substrates and not for use in polymer based systems. We would like to present our results on the development of a series of high thermal conductivity, cost effective, easy to use greases. In addition to thermal, physical and electrical properties, we will summarize reliability test data including temperature cycling, temperature/humidity exposure and high temperature aging.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132856707","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Thin film polymeric materials in microelectronic packaging and interconnect 薄膜聚合物材料在微电子封装和互连中的应用

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664433

P. Garrou

引用次数: 5

Reflow-curable polymer fluxes for flip chip encapsulation 倒装芯片封装用可回流固化聚合物助熔剂

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664425

M. Capote, S. Chu, Ligui Zhou, B. Gao, R.W. Johnson

引用次数: 9

Mechanical and microstructural characteristics of dilute SnBi and SnBiIn alloys 稀SnBi和SnBiIn合金的力学和显微组织特征

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664456

T. Reinikainen, J. K. Kivalahti

引用次数: 0

Compression flow modeling of underfill encapsulants for low cost flip chip assembly 用于低成本倒装芯片组装的下填充封装料的压缩流建模

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1900-01-01 DOI: 10.1109/ISAPM.1998.664430

N. W. Pascarella, D. Baldwin

{"title":"Compression flow modeling of underfill encapsulants for low cost flip chip assembly","authors":"N. W. Pascarella, D. Baldwin","doi":"10.1109/ISAPM.1998.664430","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664430","url":null,"abstract":"Currently, underfill dispense processing is achieved through capillary action, making it a costly and time consuming process particularly as device size increases and standoff gaps decrease. As part of the Low Cost Next Generation Flip Chip Processing Program at Georgia Tech, an advanced flip chip assembly process is being developed. This process eliminates the need for time consuming capillary flow processing, and integrates the simultaneous reflow and cure of the solder interconnect and polymer underfill. The advanced process results in a significantly lower assembly cost combined with reduced throughput time. Reduced throughput time and cost are achieved through the compression flow of the underfill material. Since the flow of the material governs assembly yield and reliability, this work focused on flow simulation studies of the placement process. Here a simulation methodology and simulation studies were conducted to characterize the compression flow of the underfill and predict void formation. Results yielded design guidelines that gave insight into process parameters such as the limits on underfill deposition geometry and underfill viscosity. The results indicated the initial limits of an overall process window for compression flow chip placement.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117168827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18