一套无铅焊料合金的热导率和比热测定

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI:10.1109/ISAPM.1998.664460

L. Kehoe, G. Crean

{"title":"一套无铅焊料合金的热导率和比热测定","authors":"L. Kehoe, G. Crean","doi":"10.1109/ISAPM.1998.664460","DOIUrl":null,"url":null,"abstract":"With the elimination of lead-based solders from electronics manufacturing there is a need to understand the properties of their replacement alloys. In particular measurements of the thermal properties of the replacement alloys are critical for quality control as well as for reliability of the lead free solder joints. This paper will address the determination of the thermal diffusivity and heat capacity of a range of lead-free solder alloys based on Sn/Ag/Cu. Utilising the Laser Flash Technique and Differential Scanning Calorimetry the thermal conductivity will then be determined by a combination of these two properties and the alloy density. A comparison of the thermal conductivity determined from SnPb37 will be made.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Thermal conductivity and specific heat determinations of a set of lead-free solder alloys\",\"authors\":\"L. Kehoe, G. Crean\",\"doi\":\"10.1109/ISAPM.1998.664460\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the elimination of lead-based solders from electronics manufacturing there is a need to understand the properties of their replacement alloys. In particular measurements of the thermal properties of the replacement alloys are critical for quality control as well as for reliability of the lead free solder joints. This paper will address the determination of the thermal diffusivity and heat capacity of a range of lead-free solder alloys based on Sn/Ag/Cu. Utilising the Laser Flash Technique and Differential Scanning Calorimetry the thermal conductivity will then be determined by a combination of these two properties and the alloy density. A comparison of the thermal conductivity determined from SnPb37 will be made.\",\"PeriodicalId\":354229,\"journal\":{\"name\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1998.664460\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1998.664460","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

摘要

随着电子制造业中铅基焊料的淘汰，有必要了解其替代合金的性能。特别是替代合金的热性能测量对于质量控制以及无铅焊点的可靠性至关重要。本文将讨论一系列基于Sn/Ag/Cu的无铅钎料合金的热扩散率和热容的测定。利用激光闪光技术和差示扫描量热法，导热系数将由这两种性能和合金密度的组合来确定。将对SnPb37测定的热导率进行比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermal conductivity and specific heat determinations of a set of lead-free solder alloys

With the elimination of lead-based solders from electronics manufacturing there is a need to understand the properties of their replacement alloys. In particular measurements of the thermal properties of the replacement alloys are critical for quality control as well as for reliability of the lead free solder joints. This paper will address the determination of the thermal diffusivity and heat capacity of a range of lead-free solder alloys based on Sn/Ag/Cu. Utilising the Laser Flash Technique and Differential Scanning Calorimetry the thermal conductivity will then be determined by a combination of these two properties and the alloy density. A comparison of the thermal conductivity determined from SnPb37 will be made.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

自引率

0.00%

发文量