Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)最新文献_第4页

Microwave characterization of low temperature cofired ceramic

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664449

P. Pruna, R. Gardner, D. Hankey, S. Turvey

{"title":"Microwave characterization of low temperature cofired ceramic","authors":"P. Pruna, R. Gardner, D. Hankey, S. Turvey","doi":"10.1109/ISAPM.1998.664449","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664449","url":null,"abstract":"The use of low temperature cofired ceramic (LTCC) materials for the manufacture of high performance microelectronic packages operating at very high frequencies has found widespread acceptance due to LTCC's durability, compactness and manufacturability. Extensive effort has been devoted to the characterization of the electrical performance of the dielectric and associated conductor materials to determine and predict performance when constructing electronic packages that operate over a broad band of frequencies from DC through high speed digital to the microwave and millimeter bands. This effort has focused on several different areas, including the effect of operating frequency on the bulk dielectric properties of the ceramic and the electrical properties of associated thick film materials, particularly conductors. The interaction of these materials during processing, has been investigated, to determine the interdependence of these characteristics, so that both design rules and processing guidelines for particular package configurations (such as microstrip and stripline) and applications may be optimized. The Ferro A6-M ceramic, has demonstrated low dielectric constant and low dielectric loss at a wide range of frequencies, is compatible with low cost, high performance conductor materials, such as silver, and may also be used in mixed metal configurations with combinations of gold and silver conductors, in applications where such an approach is necessary. This paper reviews some of the results which have been determined in electrical characterizations such as these and proposes new electrical evaluations that may prove useful in the future.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126953794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Novel technique for measuring through-plane modulus in thin polymer films 测量聚合物薄膜通过平面模量的新技术

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664440

K. Patel, P. Kohl, S. Bidstrup-Allen

引用次数: 10

Exploring silica powder and its effect on a flip chip underfill encapsulant 探索硅粉及其对倒装芯片底填料的影响

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664426

P. Klimah, J. Liu

引用次数: 1

Characterization and processing of low dielectric constant thick film substrates for electronic packaging applications 电子封装用低介电常数厚膜基板的表征与加工

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664448

D. Kellerman, L. Retherford, D. J. Nabatian, P. Bokalo, Fengmei He, F. Barlow, A. Elshabini

引用次数: 1

Immersion cooling of high heat flux microelectronics with dielectric liquids 高热流密度微电子介质液体的浸没冷却

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664464

M. Arik, A. Bar-Cohen

引用次数: 22

Thermoplastic adhesives for microwave assembly component mounting 微波组件安装用热塑性胶粘剂

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664469

K. Ouellette, K. G. Ressler

引用次数: 0

Advances in flip chip underfill material cure rates and reliability 倒装衬底材料固化率及可靠性研究进展

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664429

D. Shi, K. McKeen, B. Jenson

引用次数: 4

High frequency electrical characterization of electronic packaging materials: environmental and process considerations 电子封装材料的高频电气特性:环境和工艺考虑

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664446

D. Amey, S. Horowitz, R. Keusseyan

{"title":"High frequency electrical characterization of electronic packaging materials: environmental and process considerations","authors":"D. Amey, S. Horowitz, R. Keusseyan","doi":"10.1109/ISAPM.1998.664446","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664446","url":null,"abstract":"Recognizing the need for improved materials data to meet the needs of designers of RF and microwave products, DuPont Photopolymers and Electronic Materials (P&EM) has had an ongoing program to generate high frequency data on materials properties (dielectric constant, loss tangent and attenuation). Characterization of ceramic and printed wiring advanced interconnection materials in the 1 to 20 GHz range has been performed for a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics. Gold and silver conductors applied by both screen printing and photopatterning on these dielectrics as well as on 96% alumina have been tested. These have been benchmarked against Thin Film conductors and copper clad FR-4, Polyimide, BT and Teflon/sup (R)/ printed wiring materials. The performance of many of these systems has been reported for room temperature and humidity conditions. This presentation builds on the previous work with data on the high frequency properties of some of the advanced ceramic and printed wiring materials systems when exposed to 85/spl deg/C temperature and 85% relative humidity. In addition the high frequency performance of a new gold conductor system with both screen printed and photoetched patterning on 96% and 99% Alumina is described demonstrating the improved performance over gold Thin Film metallization typically used in Microwave applications.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115401799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Wideband electrical characterization and modeling of plastic packaging materials 塑料包装材料的宽带电特性和建模

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664447

S. Riad, W. Su, I. Salama, A. Elshabini, M. Rachlin

{"title":"Wideband electrical characterization and modeling of plastic packaging materials","authors":"S. Riad, W. Su, I. Salama, A. Elshabini, M. Rachlin","doi":"10.1109/ISAPM.1998.664447","DOIUrl":"https://doi.org/10.1109/ISAPM.1998.664447","url":null,"abstract":"Summary form only given. The paper presents the efforts performed in the areas of package modeling, and package and material (molding compound) characterization at RF/microwave frequencies. At high frequencies, material properties and properties of signal lines/interconnects are equally important. As such, the presented efforts dealt with material (molding compound) characterization of lead frames and bond wire. While the microwave characterization of the molding compounds performed in this study over a wideband of frequencies can be utilized in a variety of the plastic package structures, the objective of the model development was to develop an electrical model of 16 lead SOIC plastic packages, that gained lately a great popularity for packaging wireless RFICs. The models developed and used will be discussed along with experimental results. In this work, discussion of the techniques validation, the accuracy, the repeatability, and the variability will be conducted. For dielectric materials, such as plastic molding compounds used in RF/microwave packages, their electrical properties can be described by their relative dielectric constant and loss tangent. To measure these properties at microwave frequencies, the two most commonly used techniques are the resonant technique and the transmission line technique. In this paper, both techniques are used to characterize the dielectric properties of the plastic molding compounds. Two measurements techniques, the HP coaxial probe and the stripline resonator were used to characterize the material properties. Several issues related to these techniques will be described.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115678599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Fundamental study on adhesive strength of electrical conductive adhesives (ECAs) 导电胶粘剂(ECAs)粘接强度的基础研究

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI: 10.1109/ISAPM.1998.664468

T. Inada, C. Wong

引用次数: 7