Exploring silica powder and its effect on a flip chip underfill encapsulant

Abstract

Certain properties of silica powder can influence flip chip production, especially in the process of encapsulation and set-up time. Our study of the silica used in encapsulants shows that the particle distribution of the silica has a direct relationship with the viscosity of the encapsulant, which contains the silica. We also found that the analysts for the ranges of particle distribution serves as an excellent tool for relating the particle size with its viscosity.