{"title":"影响毛细管倒装衬底性能的一些因素","authors":"M. Edwards","doi":"10.1109/ISAPM.1998.664428","DOIUrl":null,"url":null,"abstract":"Not all capillary flip chip underfill materials are created equal. Differences that affect performance that frequently do not appear on product information sheets will be discussed. Data such as adhesion to different surfaces and flow rates will be compared for various underfill formulations. Some process variables will also be discussed.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Some factors that affect performance of capillary flip chip underfills\",\"authors\":\"M. Edwards\",\"doi\":\"10.1109/ISAPM.1998.664428\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Not all capillary flip chip underfill materials are created equal. Differences that affect performance that frequently do not appear on product information sheets will be discussed. Data such as adhesion to different surfaces and flow rates will be compared for various underfill formulations. Some process variables will also be discussed.\",\"PeriodicalId\":354229,\"journal\":{\"name\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1998.664428\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1998.664428","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Some factors that affect performance of capillary flip chip underfills
Not all capillary flip chip underfill materials are created equal. Differences that affect performance that frequently do not appear on product information sheets will be discussed. Data such as adhesion to different surfaces and flow rates will be compared for various underfill formulations. Some process variables will also be discussed.