Review of RF packaging research at Georgia Tech's PRC

Abstract

Consistent with the Packaging Research Center's vision of low cost single level integrated modules (SLIM), the Wireless Thrust is focused on developing integrated solutions for wireless interfaces. The core focus is to develop: (1) Development and analysis of multilayer microwave assemblies. The goal is to assess the critical technology break points required for SLIM and requirements for SLIM to progress to higher frequencies of operation. This project includes development of SLIM based high frequency test structures for evaluation and study. (2) Development of RF microwave packaging and interconnects for microwave multichip assemblies. This project focuses on developing the necessary structural properties for SLIM to operate at MM wave frequencies with particular emphasis upon developing vertical interconnects. (3) Development of next generation wireless integration approaches. This project focuses upon applying thin-film integration to develop three dimensional wireless ICs for direct integration with SLIM. A detailed data base development is proposed, based upon PRC SLIM prototypes, to establish measurement based methodology to accurately model entire high density interconnect systems at microwave frequencies.