27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献

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Some aspects of crosstalk for different electronic modules 某些方面的串扰适用于不同的电子模块
V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu
{"title":"Some aspects of crosstalk for different electronic modules","authors":"V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu","doi":"10.1109/ISSE.2004.1490436","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490436","url":null,"abstract":"In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":" 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114053127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
University-industry network 利用网络
E. Shoikova, V. Denishev
{"title":"University-industry network","authors":"E. Shoikova, V. Denishev","doi":"10.1109/ISSE.2004.1490868","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490868","url":null,"abstract":"In this paper we present the current initiatives, related to the university-industry partnership. We describe the use of integrated information systems to enable access to modern information and communication technologies (ICT). The complementary aspect of the same trend is to organize international cooperation, leading to IT education aimed at applying the best technologies available as well as conforming to the modern standards for e-learning.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115238382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
A comparison of quantum correction models for the three-dimensional simulation of FinFET structures 用于FinFET结构三维模拟的量子校正模型的比较
R. Entner, A. Gehring, T. Grasser, S. Selberherr
{"title":"A comparison of quantum correction models for the three-dimensional simulation of FinFET structures","authors":"R. Entner, A. Gehring, T. Grasser, S. Selberherr","doi":"10.1109/ISSE.2004.1490388","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490388","url":null,"abstract":"For the prediction of the device performance of FinFET structures, 3D device simulation is inevitable. Due to the strong quantum mechanical confinement in the channel, quantum correction models need to be applied. Two of these models, where one is based on the correction of the density-of-states in a pre-processing step and the other calculates a correction for the band edge energy, have been implemented in the device simulator Minimos-NT. The models have been applied to the simulation of double- and triple-gate FinFET structures. However, while the drive current reduction can be reproduced, the carrier concentration in the fin shows only poor agreement with rigorous quantum mechanical simulation.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115340010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A high power high frequency laser diodes driver 一种大功率高频激光二极管驱动器
P. Yankov, D. Todorov
{"title":"A high power high frequency laser diodes driver","authors":"P. Yankov, D. Todorov","doi":"10.1109/ISSE.2004.1490854","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490854","url":null,"abstract":"Summary form only given. A new high power laser diode driver has been developed and tested. The possibilities for driving high power laser diode bars and stacks at high frequencies has been shown. The driver is with 0.5% noise and ripple at DC, and can be modulated with 15 ns rise/fall times at 100 A, with maximum frequency for square wave modulation up to 5 MHz. The spikes for the optical output at switching on/off do not exceed 5%. The limitation of the used scheme allows frequencies up to 30 MHz and currents to 400 A to be reached. The driver opens new applications with laser diodes with more than 100 W CW output power. This output power means free space communication at 20 Mbit/s over hundreds of kilometres, the possibility for a 3D range finder with 15 km distance (without a retro prism) and 1 cm distance accuracy, new possibilities for micro machining, synchro pumping solid state lasers or other semiconductor lasers, etc.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124933658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Wireless data transmission between personal computers 个人电脑之间的无线数据传输
N. Stuban
{"title":"Wireless data transmission between personal computers","authors":"N. Stuban","doi":"10.1109/ISSE.2004.1490426","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490426","url":null,"abstract":"The paper presents a radio frequency data transmission system between PCs or other units communicating via the RS-232 interface. The main functionality of the proposed system is to transfer data between two PCs without any cable connection. The heart of the circuit is a Telecontrolli radio frequency module. The main task to control the data transfer is done by a PIC microcontroller. Since the wireless communication is noisy, a special error recognition and correction algorithm and a protocol using them were developed. Both are implemented in the microcontroller. The error correction algorithm is Hamming coding.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116690566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Integrating power quality sensors in a wireless network 在无线网络中集成电能质量传感器
C. Gabriel, P. Ovidiu
{"title":"Integrating power quality sensors in a wireless network","authors":"C. Gabriel, P. Ovidiu","doi":"10.1109/ISSE.2004.1490396","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490396","url":null,"abstract":"Due to the present continuous development of more and more power efficient electronic devices, a comprehensive analysis of the power quality within an energy distribution area is a difficult task. Since filtering and compensation devices for power factor are no longer a solution, the continuous monitoring and control of power quality for each device in an energy distribution network becomes mandatory. A better solution is to integrate power quality sensors in each electronic device and to implement a control solution for continuous network surveillance. The large number of electronics devices targeted for power quality surveillance usually raises the problem of integrating the sensors in a control network. The paper presents a model of a power quality control system consisting of a distributed network of sensors integrated in a wireless network in order to reduce wire harnesses and to implement a fast communication link with each sensor or controller device. The main challenges of such a design along with its benefits are detailed. The proposed system allows a better energy control along with efficient communication architecture, increasing the power quality \"awareness\" of the energy distribution network.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122981406","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Evaluation of equipment capability for precision placing of electronic components by using SPC (statistical process control) 用SPC(统计过程控制)评价电子元件精密放置的设备性能
V. Tsenev, I. Petrova
{"title":"Evaluation of equipment capability for precision placing of electronic components by using SPC (statistical process control)","authors":"V. Tsenev, I. Petrova","doi":"10.1109/ISSE.2004.1490448","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490448","url":null,"abstract":"SPC control is a statistical method for evaluating whether a process is under control and is capable. It has been developed on the basis of comprehensive mathematical statistical methods and it is already largely used for process improvement in the discrete electronic industry. This report describes an SPC study of capabilities for precise and stable placing of electronic components on printed circuit boards. Predictions and real results are presented for a specific assembly machine.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130779179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Models Of Technology And Change In Higher Education 高等教育中的技术与变革模式
E. Shoikova
{"title":"Models Of Technology And Change In Higher Education","authors":"E. Shoikova","doi":"10.1109/ISSE.2004.1490364","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490364","url":null,"abstract":"The aim of this paper is to present investigations about which scenarios are emerging with respect to the use of information and communication technology (ICT) in higher education (HE) and how future developments can be predicted and strategic choices can be made based on that. It seeks to answer the following questions: what strategic responses do institutions make with respect to the use of ICT; which external conditions and developments influence these choices; which external and internal conditions and measures are taken in order to achieve strategic targets; what are the implications for technology use, teaching and learning processes and staff? The main conclusions and recommendations defined are the base for implementing the most suitable scenario for the Technical University of Sofia's wide use of ICT.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128016063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 79
Analysis of reflections for different electronic modules 不同电子模块的反射分析
V. Golumbeanu, C. Ionescu, N. Codreanu, P. Balan
{"title":"Analysis of reflections for different electronic modules","authors":"V. Golumbeanu, C. Ionescu, N. Codreanu, P. Balan","doi":"10.1109/ISSE.2004.1490434","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490434","url":null,"abstract":"In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133540834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electrostatic discharge pre-compliance testing in electronics 电子产品静电放电预符合性试验
A. Lazarov
{"title":"Electrostatic discharge pre-compliance testing in electronics","authors":"A. Lazarov","doi":"10.1109/ISSE.2004.1490449","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490449","url":null,"abstract":"Some theoretical and practical considerations are given in this paper, concerning the necessity of pre-compliance testing of electronic components. A short frequency analysis is made in order to emphasize that the electrostatic discharge phenomena is similar to an HF electromagnetic disturbance. The \"body metallic model\" for discharge simulation is recommended as one of the most severe tests.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132582820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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