{"title":"不同电子模块的反射分析","authors":"V. Golumbeanu, C. Ionescu, N. Codreanu, P. Balan","doi":"10.1109/ISSE.2004.1490434","DOIUrl":null,"url":null,"abstract":"In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Analysis of reflections for different electronic modules\",\"authors\":\"V. Golumbeanu, C. Ionescu, N. Codreanu, P. Balan\",\"doi\":\"10.1109/ISSE.2004.1490434\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.\",\"PeriodicalId\":342004,\"journal\":{\"name\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2004.1490434\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2004.1490434","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of reflections for different electronic modules
In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.