V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu
{"title":"某些方面的串扰适用于不同的电子模块","authors":"V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu","doi":"10.1109/ISSE.2004.1490436","DOIUrl":null,"url":null,"abstract":"In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":" 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Some aspects of crosstalk for different electronic modules\",\"authors\":\"V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu\",\"doi\":\"10.1109/ISSE.2004.1490436\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.\",\"PeriodicalId\":342004,\"journal\":{\"name\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"volume\":\" 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2004.1490436\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2004.1490436","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Some aspects of crosstalk for different electronic modules
In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.