某些方面的串扰适用于不同的电子模块

V. Golumbeanu, P. Svasta, C. Ionescu, R. Mackabinski, M. Davidescu
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引用次数: 0

摘要

本文对不同电子模块的串扰进行了分析,并对不同情况下的串扰电压进行了计算、仿真和测量。为了评价串扰,实现了不同的实验电子模块:采用经典技术实现双层(以FR4衬底)和FELA(以各种类型的玻璃作为基片和介电基片,甚至以导电基片作为固体铝,介电基片作为基片与含迹层之间的薄层的特殊层压板和结构);具有不同类型的数字电路(TTL、S、LS、HCT、HC、AC);用不同的方法来减少相声。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Some aspects of crosstalk for different electronic modules
In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.
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