{"title":"Analysis of reflections for different electronic modules","authors":"V. Golumbeanu, C. Ionescu, N. Codreanu, P. Balan","doi":"10.1109/ISSE.2004.1490434","DOIUrl":null,"url":null,"abstract":"In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2004.1490434","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In the paper we analyzed the reflections for different electronic modules, and for this we computed, simulated and measured the voltage of reflection for different situations. For a complex evaluation of reflection, different experimental electronic modules are realized: double PCB realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate, or even a conductive substrate such as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); and the technological type of digital circuit. The measured results are compared with computed and simulated results. An interesting comparison is realized between the FR4 and FELA technology.