27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献_第6页

Reliability of lead free solders joints and manufacturability during the SMT process 在SMT过程中无铅焊点的可靠性和可制造性

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490883

T. Herzog

{"title":"Reliability of lead free solders joints and manufacturability during the SMT process","authors":"T. Herzog","doi":"10.1109/ISSE.2004.1490883","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490883","url":null,"abstract":"In systematic investigations the failure behaviour of lead free solder joints for different solder alloys as well as substrate metallization was analyzed. The emphasis of the investigations was the optimization of the processing parameters for the printing of different lead-free no-clean solder pastes in the standard pitches from 1.27 mm to 0.4 mm. Furthermore, evidence was provided of the aging-determined changes of the solder joints by means of a sensitive resistance measurement system and in correlation therefore illustrated on the basis of metallographic cross sectioning. Therefore, a demonstrator was developed on FR4 with the electroless tin and electroless nickel/immersion gold (ENIG) surface metallizations and assembled with the leadless chip components R0402, R0603, and R0805 with pure tin metallization. As alternative lead-free solders were examined the eutectic alloy SnAg3.8CuO.7, SnAg3.5 and the SnAg0.2Cu1.0 solder. The aging and/or failure behaviour of the solder joints was detected and evaluated statistically for thermal shock aging from zero to 2000 cycles with -40 C to 125/spl deg/C by means of a special 4 probe measurement. With the help of these investigations, not only the number of failures as a function of the cycles, but also the influences of the solder alloys and metallization on the failure behaviour could be determined.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128429296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Criteria for integral estimation of electromagnetic compatibility 电磁兼容性积分估计准则

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490381

I. Korobko

引用次数: 0

Packaging concept for a miniaturized wirelessly interrogable temperature logger 小型化无线可查询温度记录仪的包装概念

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490378

M. Mundlein, J. Nicolics, M. Brandl

{"title":"Packaging concept for a miniaturized wirelessly interrogable temperature logger","authors":"M. Mundlein, J. Nicolics, M. Brandl","doi":"10.1109/ISSE.2004.1490378","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490378","url":null,"abstract":"We present the packaging concept of a miniaturized, biocompatible temperature logger. In a first application, the device will be cast in the palate piece of a removable brace to observe the wearing habit of the patient. For this purpose the temperature is measured with a pn junction and recorded using a micro controller which acts as a temperature logger and is capable of storing the thermal history from several months. This device is hermetically sealed using polymeric encapsulants. The data exchange is carried out using a wireless interrogating transponder using radio frequency identification device (RFID) technology. The function principle of this data transfer technology is explained briefly. Due to the limited space in the brace, an extremely high level of miniaturization is necessary. To reach this goal, the device is built-up as a multichip module using a single sided FR4 printed circuit board with a line width of down to 35 /spl mu/m. The entire prototype fabrication process, including details on miniaturization related difficulties, is described. Also, the paper describes the finding and evaluation of a biocompatible casting material as needed for a medical application. An easy way for the direct assessment of water absorption and its effect on the electrical function of the module is also presented.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116798484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Piezoelectric resonance sensor array 压电谐振传感器阵列

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490428

V. Todorova, D. Kolev

引用次数: 3

Remote access solutions for industrial control systems 工业控制系统的远程访问解决方案

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490371

A. Drumea, P. Svasta, C. Popescu

{"title":"Remote access solutions for industrial control systems","authors":"A. Drumea, P. Svasta, C. Popescu","doi":"10.1109/ISSE.2004.1490371","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490371","url":null,"abstract":"The majority of current industrial control systems are easily configurable and they offer a lot of data about the state of the controlled process. Unfortunately, most of this information is only accessible locally, making difficult the integration of these systems into a centralized control and information management system. To solve this problem, it is necessary to provide the control systems with remote access capabilities. The paper investigates some of the usual solutions for remote access - analog PSTN (public switched telephone network) communications, GSM based communications (using SMS, short message system; using V32 data connections; using GPRS, general packet radio service, connections) and Ethernet based communications. Hardware requirements and how to implement each of these solutions into different embedded systems are also analyzed. Advantages and disadvantages of each solution are studied considering different criteria - price, communication speed, security, implementation effort and user friendliness -and a procedure for selecting an appropriate remote access solution for a real application is presented.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123818163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Thermal characterisation of planar transformers 平面变压器的热特性

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490435

P. Svasta, C. Ionescu, N. Codreanu, V. Golumbeanu

{"title":"Thermal characterisation of planar transformers","authors":"P. Svasta, C. Ionescu, N. Codreanu, V. Golumbeanu","doi":"10.1109/ISSE.2004.1490435","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490435","url":null,"abstract":"Planar inductors and transformers are widely used today in various electronic applications either as stand alone devices or integrated in the printed circuit board (PCB) of the electronic assembly. In the frame of co-operation the Slovenian partner in a bilateral Romanian-Slovenian co-operation has presented an idea regarding the development of a DC/DC converter as a hybrid electronic product. The key part of the converter is a planar transformer (PT), this design being necessary due to the request for miniaturisation of the final module. The PT shall be finally integrated into the substrate of the converter but firstly shall be realized as a stand alone component. For the substrate a multilayer structure, based on FR4 substrate, shall be used. The authors have considered that the planar technology is the only one which produces high performance results, that is suitable for a modern hybrid power converter. Furthermore, planar technology provides enhanced performance and valuable manufacturing benefits over conventional technology. The planar technology shall lead to magnetic and electrical benefits in both a low leakage inductance and low windings AC resistance. On the other hand, the cooling of such transformers can be of some concern. The paper presents the modelling and simulation of the thermal regime of the transformer. From the estimated work frequencies, at about 300 kHz, the power losses are calculated and used as loads in a subsequent thermal analysis. The results will be very useful in order to estimate the thermal stresses of the magnetic core and of the PCB.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129511297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Design and implementation of a V-f converter using FPAA 基于FPAA的V-f转换器的设计与实现

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490391

P. Yakimov, E. Manolov, M. Hristov

引用次数: 17

Polycrystalline Si films on glass substrates prepared by metal induced crystallization 金属诱导结晶法制备玻璃基板上的多晶硅薄膜

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490871

D. Dimova‐Malinovska, O. Angelov, M. Sendova-Vassileva, V. Grigorov, J. Pivin

引用次数: 2

Accelerated fatigue test methods of lead-free solder joints in surface mounting technology 表面贴装技术中无铅焊点加速疲劳试验方法

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490385

D. Zdzislaw, B. Jaroslaw, D. Jaroslaw, S. Marcin

引用次数: 2

Common trends in the development of component base of the present automation 元器件基地是目前自动化发展的共同趋势

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490376

K. Kasev, E. Ivanov, N. Stoytcheva

引用次数: 0