27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献

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Properties and utilization of 3D bent-multilayer hybrid structures 三维弯曲-多层复合结构的性能及应用
S. Slosarcik, A. Pietrikova, J. Urbančík, W. Kalita, R. Bauer
{"title":"Properties and utilization of 3D bent-multilayer hybrid structures","authors":"S. Slosarcik, A. Pietrikova, J. Urbančík, W. Kalita, R. Bauer","doi":"10.1109/ISSE.2004.1490437","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490437","url":null,"abstract":"The specific properties and advantages of the LTCC can be profitably included into the MCM (multi chip module) production technology, sensorial and three-dimensional application using multilayer structures. This paper deals with special treatment of LTCC, which is aimed at construction of 3D bent-multilayer hybrid structures for sensorial applications. The paper refers to general trends and gives an overview of hybrid technology progress and results of reached experiments: experimental analysis of 3D bent multilayer structures and their production technology, inside conductive inspection at bending vertex location represented by the non-destructive measurement of the transitional resistance between two conductive layers, measurement principle of the values of interconnection resistance and principle of the law value interconnection resistance based on computer aided semiautomatic measurements. The 3D bent-multilayer hybrid structures find utilization in sensorial application.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130609809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Noise analysis of operational amplifier circuits using MATLAB 运算放大器电路的噪声分析
K. Asparuhova, E. Gadjeva
{"title":"Noise analysis of operational amplifier circuits using MATLAB","authors":"K. Asparuhova, E. Gadjeva","doi":"10.1109/ISSE.2004.1490859","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490859","url":null,"abstract":"Accurate and detailed noise calculations for operational amplifier circuits using MATLAB are proposed. The analysis of the basic op amp circuits (inverting, non-inverting and differential circuits) is performed taking into account the specifics of current and voltage amplifiers. The MATLAB function m-files are developed to predict the noise. The following characteristics are calculated: total output spot noise voltage; total equivalent input spot noise voltage; noise power; integrated noise with its two components, 1/f noise voltage and equivalent white noise voltage; noise figure. Data sheets are only needed to use programs for the particular circuit configuration. The results are verified with the PSpice simulator. The proposed MATLAB noise functions give the possibility of investigating the noise behavior of the basic analog blocks, which are characterized by accuracy and simplicity.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116110631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
System for test and verification of the thermostat from automobile cooling system 用于汽车冷却系统恒温器的测试和验证系统
I. Lita, I. B. Cioc, M. Teodorescu, D. Visan
{"title":"System for test and verification of the thermostat from automobile cooling system","authors":"I. Lita, I. B. Cioc, M. Teodorescu, D. Visan","doi":"10.1109/ISSE.2004.1490848","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490848","url":null,"abstract":"This paper presents a PC-based system for test and verification of the thermostat from an automobile cooling system. The application measures the displacement of the thermostat valve as a function of temperature. Measurement data are plotted and then stored in a file. The application was developed in LabVIEW, the most commonly used graphical language for virtual instrumentation. For measurement and data acquisition, a module from the I-7000 series, made by ICPDAS, was used which has great performance and is very easily to use. By combining the performance of these modules with the great flexibility and stability of the LabVIEW programming language, a measurement system can be designed that assures very good accuracy, stability and reliability, with low cost.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116168872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Short-time trends in market development of information communication technologies (ICT) and Bulgaria's place in it 信息通信技术(ICT)市场发展的短期趋势和保加利亚在其中的地位
M. Ivanova, I. Iliev
{"title":"Short-time trends in market development of information communication technologies (ICT) and Bulgaria's place in it","authors":"M. Ivanova, I. Iliev","doi":"10.1109/ISSE.2004.1490875","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490875","url":null,"abstract":"Using analysis of the information communication technologies market in a short time period, the authors have observed the market developments during the last 10 years of the 20th century. They show market differentiation based on the type of sector (private and public) and also four levels of segmentation - services, software, hardware and total status.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1068 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122887463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Capacitive button for application in higher humidity environment [position sensors] 用于高湿度环境的电容式按钮[位置传感器]
A. Pietrikova, M. Somora, S. Kardoš, M. Micenko
{"title":"Capacitive button for application in higher humidity environment [position sensors]","authors":"A. Pietrikova, M. Somora, S. Kardoš, M. Micenko","doi":"10.1109/ISSE.2004.1490439","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490439","url":null,"abstract":"The aim of the work is to investigate the possibilities of capacitive sensing of driver position, and by virtue of the results, to design and to realize a few models which will demonstrate the principle, practically. The paper describes two types of capacitive driver. Each of them differently defines its present position. They were made by polymer thick film technology (PTFT) onto polyester foil.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122697800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Remote sensing of position and acceleration 位置和加速度遥感
M. Gabriel, I. Luiza
{"title":"Remote sensing of position and acceleration","authors":"M. Gabriel, I. Luiza","doi":"10.1109/ISSE.2004.1490845","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490845","url":null,"abstract":"Acceleration and position transducers are one of the most widely used sensors for monitoring civil engineering structures, mechanical devices, industrial process systems and even biomedical systems. One of the main issue in designing instrumentation with such sensors is the ability of remote interaction in order to reduce as much is possible any interference with the measured physical value. This statement usually implies the use of low power embedded systems for acceleration and position sensing and wireless data transfer for acquiring relevant readings. This paper proposes a low power embedded sensing system for acceleration and position based on a common capacitive transducer. The system integrates in one single chip the signal conditioning blocks (for the transducers), the analog-to-digital converter and a fast infrared communication module for data transmission. The proposed solution increases the possibility of integrating arrays of such low-cost sensors in remote sensing network systems for acceleration and position, allowing an increased accuracy and performance for all interested domains of application.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121994446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of CMOS OTA core for practical education 实用教育CMOS OTA核心设计
O. Antonova, D. Pukneva, E. Manolov, M. Hristov
{"title":"Design of CMOS OTA core for practical education","authors":"O. Antonova, D. Pukneva, E. Manolov, M. Hristov","doi":"10.1109/ISSE.2004.1490446","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490446","url":null,"abstract":"In this paper is presented an operational transconductance amplifier (OTA) core. With this core can be configured and reconfigured the two most frequently used OTA circuits - Miller's OTA (with frequency correction) and simple OTA (without frequency correction). The core architecture is built of an analog transistor array, which allows examination of the circuits for a wide range of reference current. With these characteristics the described core is very appropriate for education in each contemporary course of analog VLSI electronics.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131115972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Common platform for bipotentiostatic biocatalytic sensors and DNA sensors with electronically addressed immobilization 双电位生物催化传感器和电子定位固定DNA传感器的通用平台
H. Santha, G. Harsányi, B. Sinkovics, A. Takács
{"title":"Common platform for bipotentiostatic biocatalytic sensors and DNA sensors with electronically addressed immobilization","authors":"H. Santha, G. Harsányi, B. Sinkovics, A. Takács","doi":"10.1109/ISSE.2004.1490393","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490393","url":null,"abstract":"A new miniaturized electrochemical cell has been designed and constructed by utilization of different electronics technologies. The 25-50 /spl mu/l capacity of the cylindrical shaped electrochemical cell has been built up by cutting circles in 5-10 overlapping layers of 400 /spl mu/m thick Teflon foil. This multilayer structure enables very flexible solutions for inlet and outlet of different materials into the electrochemical cell. The number of working electrodes of the biosensor substrates can vary between 1-80. The reference electrode has been made of a silver wire. The circular symmetry of the counter and reference electrodes and the pattern of the working electrode array allows bipotentiostatic measurements, thus, this flexible platform is suitable for a wide range of experiments of both bipotentiostatic biocatalytic sensors and DNA sensors with electronically addressed immobilization.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122146419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Formal models for system design (challenges on exchanges in the main role between hardware and software going to the systems packaging) 系统设计的形式化模型(对硬件和软件之间主要角色的交换提出挑战,并将其转移到系统包装中)
I. E. Ivanov, V. Georgiev
{"title":"Formal models for system design (challenges on exchanges in the main role between hardware and software going to the systems packaging)","authors":"I. E. Ivanov, V. Georgiev","doi":"10.1109/ISSE.2004.1490879","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490879","url":null,"abstract":"This paper envisages main trends in systems design. Observation over and comparison between paradigms in software and hardware design is presented. Finally the paper focuses on three of most popular and important hardware design languages VHDL, SDL and SystemC. A special stress is done on how do they work outside hardware design and how they do package software and hardware in one device.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128103177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Device for visualization of information from linear optical sensor 用于显示线性光学传感器信息的装置
N. Krantov, T. Djamiykovi, M. Dontscheva
{"title":"Device for visualization of information from linear optical sensor","authors":"N. Krantov, T. Djamiykovi, M. Dontscheva","doi":"10.1109/ISSE.2004.1490847","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490847","url":null,"abstract":"In engineering practice, over and over again, there is an increase in the area of applications based on linear and matrix array optical sensors which are sensitive to EM radiation and produce electrical signals in proportion to the radiation strength. Constructing a visualization of the received sensor data on a visual terminal-monitor is essential from the viewpoint of testing the efficiency and providing an optimal working mode of the sensor, such as setting up an integration time, and adjusting the optical system by monitoring of the digital output level of all pixels. The resources for control sensors which process the collected information are different and depend on the particular problem requiring solution. The fast growth of programmable logic naturally leads to sources for achieving a solution - these are XILINX's programmable logic devices. In addition, the versatile high hierarchy language VHDL for describing, simulating, synthesizing and implementing of digital sockets directs the final choice.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126517560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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