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27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献

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Cone-beam computer tomography as a new testing method for industrial application 锥束计算机层析成像作为一种新的测试方法在工业上的应用
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490386
M. Danczak, K. Juergen-Wolter
{"title":"Cone-beam computer tomography as a new testing method for industrial application","authors":"M. Danczak, K. Juergen-Wolter","doi":"10.1109/ISSE.2004.1490386","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490386","url":null,"abstract":"Cone-beam computer tomography (CT) is a relatively new nondestructive testing method, used in industry, where the attenuation coefficient of an X-ray is measured. The fact that the samples are characterized by different density and thickness explains why various contrasts are obtained in the end results. Cone-beam CT uses a volumetric beam to scan the test object and therefore obtains a series of 2D images which are reconstructed into a 3D model. During the reconstruction process, the X-ray tube emits a polychromatic spectrum, called beam hardening, by which artefacts are often created. This process takes place because the low energy spectrum part in the material is better absorbed than the higher energy one. The basic application of this method is the visualization of the inner and outer structures of electronic components, packaging and interconnection technologies. This paper describes the basics of CT, the typical beam hardening artefacts and method to reduce their influence on the imaging quality of the measured objects. Additionally, examples of this testing method are presented.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131230235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Diagnosis of rotor faults of induction motors, operated in non-rated conditions 非额定工况下异步电动机转子故障诊断
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490387
L. Dimitrov, V. Chobanov
{"title":"Diagnosis of rotor faults of induction motors, operated in non-rated conditions","authors":"L. Dimitrov, V. Chobanov","doi":"10.1109/ISSE.2004.1490387","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490387","url":null,"abstract":"Since the number of different induction motor applications is continuously increasing, the questions of current interest are those regarding the diagnosis of their technical condition. There are many different methods for on-line diagnostics of incipient rotor faults (broken rotor bars, rings etc.) that occur during their operation. One of the most frequently used method is the frequency analysis of the stator current using the FFT-transformation (MCSA) method. This is easy to apply and is non-invasive with respect to the motor construction. The subject of consideration in the following material is the application of this method when the motor has an asymmetrical power supply and is also using an autonomous power invertor. Also presented are the characteristic frequencies from experiments with a broken induction motor rotor bar as well as possible ways for diagnosis of this condition. Different ways to implement this method are given when the induction motor has a frequency converter supply.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"125 10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124666313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Nanoscale materials - production, properties and applications 纳米材料的生产、性能和应用
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490873
I. Dragieva, K. Alexandrova
{"title":"Nanoscale materials - production, properties and applications","authors":"I. Dragieva, K. Alexandrova","doi":"10.1109/ISSE.2004.1490873","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490873","url":null,"abstract":"A well known method for the preparation of nanomaterials is the chemical reduction of metal ions, dissolved in water, with an aqueous solution of an alkali metal borohydride as the reduction agent. This method has been used to produce various compositions of nanoparticles, nanowires, nanoscale hydrogen containers, etc. The knowledge and the comparison of date for the bond strength of various diatomic molecules help us to choose proper combinations of elements in order to synthesize nano-systems with pre-requested properties.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127086341","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automated system for temperature measurement and regulation using I-7012 module 自动化系统的温度测量和调节使用I-7012模块
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490849
I. B. Cioc, I. Lita, M. Teodorescu, D. Visan
{"title":"Automated system for temperature measurement and regulation using I-7012 module","authors":"I. B. Cioc, I. Lita, M. Teodorescu, D. Visan","doi":"10.1109/ISSE.2004.1490849","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490849","url":null,"abstract":"The paper presents a PC-based temperature measurement and regulation system. The automated system for temperature regulation uses the I-7012 module for data acquisition and control signal transmission. Communication between the data acquisition module and the computer controller is made by an RS-485 interface that provides the possibility to realize a remote measurement and control system. Controller function and graphical interface software are implemented in Visual C, which provides the system with good flexibility. For comparison, the same application was developed in LabVIEW, a graphical programming language that provides a very simple way to design an application, which is easy to understand for less experienced programmers.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126978232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Stability analysis of digital radio channels under the influence of the signal inter-symbolic interference 信号符号间干扰影响下数字无线电信道稳定性分析
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490839
G. Petkov, D. Dochev, T. Iliev
{"title":"Stability analysis of digital radio channels under the influence of the signal inter-symbolic interference","authors":"G. Petkov, D. Dochev, T. Iliev","doi":"10.1109/ISSE.2004.1490839","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490839","url":null,"abstract":"Inter-symbolic interference is analyzed as a disturbance. At a given information flow and known pulse characteristics of the channel, the received signal could be defined with precision up to the additive disturbance. A mathematical model of a radio channel with frequency-dependent parameters received under inter-symbolic interference is proposed. This method for compensation of inter-symbolic interference allows evaluation of the error probability during the process of received signal recognition for different types of signal modulation and proposes algorithms for inter-symbolic interference compensation.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128271754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Polymer microwave absorber with nanosized ferrite and carbon fillers 纳米铁氧体和碳填料聚合物微波吸收体
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490882
I. Nedkov, S. Kolev, S. Stavrev, P. Dankov, S. Alexsandrov
{"title":"Polymer microwave absorber with nanosized ferrite and carbon fillers","authors":"I. Nedkov, S. Kolev, S. Stavrev, P. Dankov, S. Alexsandrov","doi":"10.1109/ISSE.2004.1490882","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490882","url":null,"abstract":"The paper presents studies on the microwave properties of two types of polymer composites based on acrylic resin and polyurethane with nanosized magnetic (magnetite) and dielectric (carbon) fillers. The microwave (MW) absorption was measured at 9.4 GHz, while the dielectric and magnetic properties were investigated in the frequency range 1-18 GHz. Promising MW absorption properties were observed for nanostructured filler applications in comparison with the traditional MW absorbers.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128597474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
New technology for recording the information based on intramolecular bonds in water 基于水分子内键的信息记录新技术
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490880
A. Antonov, T. Galabova, G. Jelev, J. Jelev
{"title":"New technology for recording the information based on intramolecular bonds in water","authors":"A. Antonov, T. Galabova, G. Jelev, J. Jelev","doi":"10.1109/ISSE.2004.1490880","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490880","url":null,"abstract":"A new technology for recording information based on the discreet spectrum of the intramolecular bond energies in water is described. For the latter the existence of a space net of bonded with H-bonds molecules with approximate tetrahedral symmetry is supposed. The discrete character of the water energy spectrum is proved by the measurement of the surface tension variations of evaporating water drops. Using the Shannon's formula, a new term information spectrum of water is introduced, in which the information related to one pair of water molecules as a function of the discrete values of the intramolecular bond energies is represented. The experimental results showing why this information spectrum as a method registered the weak physical and chemical influences on the water are represented.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123247409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Testing of normality of data files for application of SPC tools 用于SPC工具的数据文件的正常性测试
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490443
P. Mach, H. Hochlova
{"title":"Testing of normality of data files for application of SPC tools","authors":"P. Mach, H. Hochlova","doi":"10.1109/ISSE.2004.1490443","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490443","url":null,"abstract":"Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It has been found that some files have been, using some type of a test, marked as normal, but using another type of a test, marked as non-normal. It is possible to find similar results by normality testing of data files obtained from production. Therefore, complementary tools for assessment of normality of the files under test have to be used. This paper compares results of normality testing of some simulated files by three basic tests of normality: test of elective skewness and kurtosis, Anderson-Darling test, and Kolmogorov-Smirnov test. It gives also directions indicating which other tools of exploratory analysis have to be used for verification of results obtained by different tests of normality.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"167 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122886123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Evaluation of the technical condition of stroboscopic device "Terminator-2" 频闪装置“终结者-2”技术条件评价
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490424
N.G. Georgieva, A. Georgiev, D. Kovachev
{"title":"Evaluation of the technical condition of stroboscopic device \"Terminator-2\"","authors":"N.G. Georgieva, A. Georgiev, D. Kovachev","doi":"10.1109/ISSE.2004.1490424","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490424","url":null,"abstract":"This paper is dedicated to the creation of a technique for evaluating the technical condition of electronic systems. It is applied to the \"Terminator-2\" stroboscopic device, produced by the \"Soundmaster\" Company. The basic reliability characteristics have been assessed by means of a statistical interval check with unilateral confidence interval and statistic point checks - the probability of failure-free operation, the failure current parameter of the system and failure-intensity of its elements. The system probability is evaluated in all possible states with the help of a Markov model. The probability for transition from one technical condition to another is also evaluated. The possibilities of increasing the system's reliability and that of its passive and active electronic elements are analyzed. These include the capacitor battery charging scheme, impulse-discharge lamp, pulse ionizer, and control block. The developed technique may be also applied to other technical systems with the same success.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120845571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Differences between solder bonds made with SnPbAg and SnAgCu solders 用SnPbAg和SnAgCu焊料制作的焊锡键之间的差异
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490858
L. Tersztyanszky
{"title":"Differences between solder bonds made with SnPbAg and SnAgCu solders","authors":"L. Tersztyanszky","doi":"10.1109/ISSE.2004.1490858","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490858","url":null,"abstract":"Due to legislation and market trends, every electronic appliance assembler has to change leaded solders to lead free. In recent years, a number of manufacturers were simply waiting, and they know little or nothing about the behavior of lead free solders. However, there is now a necessity for lead free solders because the RoHS and WEEE directives are coming into effect by July 2006. To bring to light the particular differences between widely used industrial SnPbAg and SnAgCu solders, a test PCB for conventional SMT devices was designed and experimental soldering was done by IR reflow technology with both alloys.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129510089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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